EP 1802713 A1 20070704 - ELECTRODEPOSITION PROCESS
Title (en)
ELECTRODEPOSITION PROCESS
Title (de)
ELEKTROABSCHEIDUNGSVERFAHREN
Title (fr)
PROCEDE D'ELECTRODEPOSITION
Publication
Application
Priority
- US 2005029994 W 20050823
- US 92408504 A 20040823
Abstract (en)
[origin: US2006037861A1] The present invention is directed to an electrodeposition process for producing a coated substrate having improved properties. The electrodeposition process comprises coating a substrate with a liquid coating composition, immersing the substrate with the liquid coating composition in an electrodeposition bath, and applying an electrical current having a specified voltage to form an electrodeposition coating to the substrate. In a preferred embodiment, the electrical current is applied prior to immersing the coated substrate in the bath. The coating can further be etched to beneficially texture the surface of the coated substrate. The substrate coated with the process of the invention exhibits improved corrosion resistance, durability, lubricity, adhesion, as well as other favorable characteristics.
IPC 8 full level
CPC (source: EP US)
C09D 5/448 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US); C25D 5/34 (2013.01 - EP US); C25D 5/44 (2013.01 - EP US); C25D 5/56 (2013.01 - EP US); C25D 5/611 (2020.08 - EP US); C25D 5/623 (2020.08 - EP US); C25D 9/02 (2013.01 - EP US)
Citation (search report)
See references of WO 2006023933A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
US 2006037861 A1 20060223; EP 1802713 A1 20070704; WO 2006023933 A1 20060302
DOCDB simple family (application)
US 92408504 A 20040823; EP 05790150 A 20050823; US 2005029994 W 20050823