EP 1803338 A1 20070704 - FLEX-RIGID PRINTED CIRCUIT BY BONDING
Title (en)
FLEX-RIGID PRINTED CIRCUIT BY BONDING
Title (de)
FLEXIBEL-STARRE LEITERPLATTE DURCH BONDIERUNG
Title (fr)
CIRCUIT IMPRIME FLEX-RIGIDE PAR COLLAGE
Publication
Application
Priority
- FR 2005001357 W 20050602
- FR 0451084 A 20040602
Abstract (en)
[origin: WO2006000694A1] The invention concerns the field of printed circuits. The invention concerns a method for connecting a rigid circuit to a flexible printed circuit, characterized in that it consists, successively, in bonding the end of the flexible printed circuit on the end of the rigid circuit, so as to ensure that the electric contact pads of both circuits are superimposed back-to-back, piercing said assembly at said electric contact pads, and electrically connecting said punch-throughs by silk-screening deposition of a conductive paste.
IPC 8 full level
H05K 3/36 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01)
CPC (source: EP)
H05K 3/361 (2013.01); H05K 3/4691 (2013.01); H05K 3/0047 (2013.01); H05K 3/4069 (2013.01); H05K 3/42 (2013.01); H05K 3/429 (2013.01); H05K 2201/043 (2013.01)
Citation (search report)
See references of WO 2006000694A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
FR 2871336 A1 20051209; FR 2871336 B1 20070119; EP 1803338 A1 20070704; WO 2006000694 A1 20060105
DOCDB simple family (application)
FR 0451084 A 20040602; EP 05775280 A 20050602; FR 2005001357 W 20050602