EP 1807845 B1 20080910 - METHOD FOR THE PRODUCTION OF A POINT THAT IS TO BE KEPT FREE OF AN INSULATION, AND STRIPPING AGENT
Title (en)
METHOD FOR THE PRODUCTION OF A POINT THAT IS TO BE KEPT FREE OF AN INSULATION, AND STRIPPING AGENT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER VON EINER ISOLIERUNG FREIZUHALTENDEN STELLE EINES ISOLIERTEN LEITERS UND TRENNMITTEL
Title (fr)
PROCEDE DE PRODUCTION D'UN EMPLACEMENT DE CONDUCTEUR ELECTRIQUE DEVANT ETRE DEPOURVU D'UNE ISOLATION, ET AGENT SEPARATEUR
Publication
Application
Priority
- EP 2005055724 W 20051103
- DE 102004054527 A 20041105
Abstract (en)
[origin: WO2006048434A1] The invention relates to a method for producing an electric conductor comprising an insulation and at least one point that is to be kept free of said insulation. According to said method, the conductor, including the points that are to be kept free, is initially surrounded by a liquid, electrically non-conducting bonding agent, above all an epoxy resin, which forms the insulation after solidifying. The conductor can also be composed of several individual wires, particularly a transposed conductor, said individual conductors being electrically isolated relative to each other and being interconnected, especially glued together, by means of the bonding agent. Using a liquid stripping agent that is based on a polyvinyl alcohol or a long-chain hydrocarbon mixture and a polysaccharide filler on the point of the conductor which is to be kept free of the insulation locally prevents the bonding agent from bonding to the conductor or the individual conductors of the transposed conductor from being interconnected by means of the unsolidified mixture. Once the entire bonding agent is hard and thus the bonding agent/stripping agent mixture has solidified, the bonding agent/stripping agent mixture can easily be removed in a mechanical manner from the treated points of the conductor.
IPC 8 full level
H01B 7/18 (2006.01); H01B 3/20 (2006.01); H01B 7/38 (2006.01); H01B 19/04 (2006.01)
CPC (source: EP US)
H01B 3/40 (2013.01 - EP US); H01B 19/04 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006048434 A1 20060511; AT E408229 T1 20080915; BR PI0517097 A 20080930; CN 101044580 A 20070926; CN 101044580 B 20101222; DE 102004054527 A1 20060518; DE 102004054527 B4 20061012; DE 502005005354 D1 20081023; EP 1807845 A1 20070718; EP 1807845 B1 20080910; ES 2312033 T3 20090216; PT 1807845 E 20081202; US 2007292605 A1 20071220; US 2012076926 A1 20120329; US 8293320 B2 20121023
DOCDB simple family (application)
EP 2005055724 W 20051103; AT 05808075 T 20051103; BR PI0517097 A 20051103; CN 200580035452 A 20051103; DE 102004054527 A 20041105; DE 502005005354 T 20051103; EP 05808075 A 20051103; ES 05808075 T 20051103; PT 05808075 T 20051103; US 201113313480 A 20111207; US 66721205 A 20051103