Global Patent Index - EP 1808667 A3

EP 1808667 A3 20070801 - Metal fusing material and method for manufacturing a carrier for a duct with metal fusing material

Title (en)

Metal fusing material and method for manufacturing a carrier for a duct with metal fusing material

Title (de)

Metall-Fixiermaterial-Durchführung und Verfahren zur Fertigung eines Grundkörpers einer Metall-Fixiermaterial-Durchführung

Title (fr)

Réalisation de matériau de fixation en métal et procédé de fabrication d'un corps de base d'une réalisation de matériau de fixation en métal

Publication

EP 1808667 A3 20070801 (DE)

Application

EP 07006641 A 20040206

Priority

  • EP 04002670 A 20040206
  • DE 20303413 U 20030303
  • DE 10321067 A 20030510
  • DE 10326253 A 20030611
  • DE 20314580 U 20030920

Abstract (en)

[origin: DE20314580U1] First (4) and second (5) metal pins fit in a through-opening (TO) (11) in a main body (MB) (3) in fastening equipment (FE) (6). Formed by an element, the MB has front (8) and rear (7) sides. A release action creates a principal geometry to describe the TO. Devices between the front and rear sides avoid relative movement in the FE towards the rear side opposite the inner circumference of the TO. An independent claim is also included for a method for producing a main body for a metal lead-through according to the present invention.

IPC 8 full level

B60R 21/26 (2006.01); F42B 3/12 (2006.01); F42B 3/198 (2006.01)

CPC (source: EP)

F42B 3/103 (2013.01); F42B 3/195 (2013.01); F42B 3/198 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

Designated extension state (EPC)

AL LT LV MK

DOCDB simple family (publication)

DE 20314580 U1 20040805; EP 1808667 A2 20070718; EP 1808667 A3 20070801; EP 1808667 B1 20160608; EP 2251633 A2 20101117; EP 2251633 A3 20111116; EP 2251633 B1 20160817; EP 3081896 A1 20161019; EP 3081896 B1 20180718; ES 2621130 T3 20170703; ES 2688222 T3 20181031; HU E032232 T2 20170828; HU E040292 T2 20190228; JP 2010133698 A 20100617; JP 2013130388 A 20130704; JP 2015143611 A 20150806; JP 6000132 B2 20160928; JP 6181096 B2 20170816

DOCDB simple family (application)

DE 20314580 U 20030920; EP 07006641 A 20040206; EP 10009095 A 20040206; EP 16169869 A 20040206; ES 10009095 T 20040206; ES 16169869 T 20040206; HU E10009095 A 20040206; HU E16169869 A 20040206; JP 2009270630 A 20091127; JP 2013000102 A 20130104; JP 2015038800 A 20150227