EP 1809780 A2 20070725 - IRON-NICKEL ALLOY STRIP FOR THE MANUFACTURE OF SUPPORT GRIDS FOR INTEGRATED CIRCUITS
Title (en)
IRON-NICKEL ALLOY STRIP FOR THE MANUFACTURE OF SUPPORT GRIDS FOR INTEGRATED CIRCUITS
Title (de)
EISEN-NICKEL-LEGIERUNGSSTREIFEN ZUR HERSTELLUNG VON HALTEGITTERN FÜR INTEGRIERTE SCHALTKREISE
Title (fr)
BANDE D ALLIAGE FER-NICKEL POUR LA FABRICATION DE GRILLES SUPPORT DE CIRCUITS INTEGRES
Publication
Application
Priority
- FR 2005002741 W 20051104
- FR 0411854 A 20041105
Abstract (en)
[origin: WO2006051188A2] The invention concerns an iron-nickel alloy strip comprising the following expressed in wt. %: 32 = Co + Ni = 45 %, 0 = Co = 6.5 %. 0 = Cr = 6.5 %, Cu = 3 %, Si = 0.5 %, Mn = 0.75 %, the rest being made up of iron and unavoidable impurities resulting from production, whereof the microstructure has a recrystallized volume fraction ranging from 3 to 97 %, whereof the thickness is less than 0.5 mm. The invention also concerns the use thereof in the manufacture of support grids for integrated circuits.
IPC 8 full level
C21D 8/02 (2006.01); C22C 38/08 (2006.01); C22C 38/10 (2006.01); C22C 38/18 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP US)
C21D 6/001 (2013.01 - EP US); C21D 8/0205 (2013.01 - EP US); C22C 38/08 (2013.01 - EP US); C22C 38/105 (2013.01 - EP US); H01L 23/49579 (2013.01 - EP US); C21D 8/0226 (2013.01 - EP US); C21D 8/0236 (2013.01 - EP US); C21D 8/0268 (2013.01 - EP US); C21D 8/0273 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 2006051188A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
FR 2877678 A1 20060512; FR 2877678 B1 20061208; CN 101084321 A 20071205; EP 1809780 A2 20070725; JP 2008519161 A 20080605; JP 2012177194 A 20120913; JP 5037352 B2 20120926; US 2009120542 A1 20090514; US 8328961 B2 20121211; WO 2006051188 A2 20060518; WO 2006051188 A3 20070607
DOCDB simple family (application)
FR 0411854 A 20041105; CN 200580043883 A 20051104; EP 05814999 A 20051104; FR 2005002741 W 20051104; JP 2007539608 A 20051104; JP 2012058896 A 20120315; US 71864905 A 20051104