Global Patent Index - EP 1812187 B1

EP 1812187 B1 20101110 - POWDER METAL COMPOSITION COMPRISING SECONDARY AMIDES AS LUBRICANT AND/OR BINDER

Title (en)

POWDER METAL COMPOSITION COMPRISING SECONDARY AMIDES AS LUBRICANT AND/OR BINDER

Title (de)

SEKUNDÄRE AMIDE ALS SCHMIERMITTEL UND/ODER BINDEMITTEL UMFASSENDE PULVERMETALLZUSAMMENSETZUNG

Title (fr)

COMPOSITION DE POUDRE METALLIQUE COMPRENANT DES AMIDES SECONDAIRES EN TANT QUE LUBRIFIANT ET/OU LIANT

Publication

EP 1812187 B1 20101110 (EN)

Application

EP 05783351 A 20050916

Priority

  • SE 2005001343 W 20050916
  • SE 0402239 A 20040917
  • SE 0500072 A 20050112

Abstract (en)

[origin: WO2006031193A1] The invention concerns a powder metal composition comprising an iron based powder and a lubricant and/or binder comprising at least one secondary amide of the general formula: R<sub

IPC 8 full level

B22F 1/00 (2022.01); B22F 1/10 (2022.01); C22C 33/02 (2006.01)

IPC 8 main group level

C22C (2006.01)

CPC (source: EP KR US)

B22F 1/00 (2013.01 - EP KR US); B22F 1/10 (2022.01 - EP KR US); C22C 33/02 (2013.01 - KR); B22F 2003/023 (2013.01 - EP); B22F 2998/00 (2013.01 - EP)

C-Set (source: EP KR US)

B22F 2998/00 + B22F 1/16 + B22F 1/10 + C22C 33/02

Citation (examination)

DOROFEEV B. YU. ET AL.: "Formation of properties and interparticular concrescence of hotformed powder materials", 1991, pages 789 - 794

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2006031193 A1 20060323; AT E487552 T1 20101115; BR PI0515368 A 20080722; BR PI0515368 B1 20140729; CA 2580509 A1 20060323; CA 2580509 C 20101116; CN 101022903 A 20070822; CN 101022903 B 20101110; DE 602005024708 D1 20101223; EP 1812187 A1 20070801; EP 1812187 B1 20101110; JP 2008513602 A 20080501; JP 4887296 B2 20120229; KR 100862785 B1 20081013; KR 20070046958 A 20070503; MX 2007003194 A 20070516; PL 1812187 T3 20110429; RU 2007114275 A 20081027; RU 2351434 C2 20090410

DOCDB simple family (application)

SE 2005001343 W 20050916; AT 05783351 T 20050916; BR PI0515368 A 20050916; CA 2580509 A 20050916; CN 200580031161 A 20050916; DE 602005024708 T 20050916; EP 05783351 A 20050916; JP 2007532287 A 20050916; KR 20077007022 A 20070328; MX 2007003194 A 20050916; PL 05783351 T 20050916; RU 2007114275 A 20050916