EP 1816237 A1 20070808 - Process and apparatus for the coating of surfaces of substrate
Title (en)
Process and apparatus for the coating of surfaces of substrate
Title (de)
Verfahren und Vorrichtung zur Beschichtung von Substratoberflächen
Title (fr)
Procédé et appareil pour le placage de surfaces d'un substrat
Publication
Application
Priority
EP 06002099 A 20060202
Abstract (en)
Method for coating substrates with metals or oxides uses a coating bath containing at least one component whose concentration changes during coating and which is added or removed as required. This is carried out in relation to variations in the density of the bath. Independent claims are included for: (A) apparatus for adding or removing components from the coating bath comprising tanks (1A - 1F) of bath components which are fitted with pumps, a control unit (3) using sensors (4) to determine the density of the electrolyte; and (B) use of the apparatus for carrying out the method.
Abstract (de)
Verfahren zur Beschichtung von Substratoberflächen mit einer metallischen oder oxidischen Schicht in einem Beschichtungsbad, wobei das Bad wenigstens eine Komponente aufweist, deren Konzentration sich im Laufe des Beschichtungsprozesses ändert und welche infolge dessen zur Erhaltung der Badqualität ergänzt oder entnommen werden muß, dadurch gekennzeichnet, daß die Ergänzung und/oder Entnahme der Komponente in Abhängigkeit von der Dichte der Badzusammensetzung erfolgt.
IPC 8 full level
C23C 18/16 (2006.01); C25D 21/12 (2006.01); C25D 21/14 (2006.01)
CPC (source: EP KR US)
C23C 18/16 (2013.01 - KR); C23C 18/1617 (2013.01 - EP US); C23C 18/1683 (2013.01 - EP US); C23C 18/36 (2013.01 - EP US); C25D 21/12 (2013.01 - EP KR US); C25D 21/14 (2013.01 - EP KR US)
Citation (search report)
- [X] US 2002166772 A1 20021114 - HENDRIKS JAN JAQUES MARIE [NL], et al
- [X] US 3765436 A 19731016 - WOLF G, et al
- [X] US 5368716 A 19941129 - KIKUTA MAKOTO [JP]
- [X] US 6277180 B1 20010821 - CONDRA RICHARD CARROLL [US], et al
- [X] US 6361677 B1 20020326 - FRITZINGER BERNARD [FR], et al
- [X] US 3637473 A 19720125 - GREENSPAN LAWRENCE, et al
- [X] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 04 31 March 1998 (1998-03-31) & DATABASE WPI Section Ch Week 199809, Derwent World Patents Index; Class M11, AN 1998-095940, XP002385516, IKENAGA YUJI: "Plating liquid density estimation in continuous electroplating installation-involves measuring density by density estimation model based on mas balance of component material in plating liquid which is used for plating installation blocks"
- [X] PATENT ABSTRACTS OF JAPAN vol. 005, no. 140 (C - 070) 4 September 1981 (1981-09-04) & DATABASE WPI Section Ch Week 198104, Derwent World Patents Index; Class B05, AN 1981-38439d, ARAKI K, SAKAI H, SUGIRUA Y: "Electroless plating bath control - by measuring concentration and density and adding consumable and non-consumable components"
- [X] PATENT ABSTRACTS OF JAPAN vol. 009, no. 254 (C - 308) 11 October 1985 (1985-10-11) & DATABASE WPI Section Ch Week 198611, Derwent World Patents Index; Class M11, AN 1986-071419, "Automatic treatment of surface treating liq. - involves detecting density gradient and adding replenishing liq."
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
EP 1816237 A1 20070808; CN 101437986 A 20090520; CN 101437986 B 20131211; EP 1979511 A2 20081015; EP 1979511 B1 20181031; ES 2706874 T3 20190401; JP 2009525404 A 20090709; JP 5695295 B2 20150401; KR 101466995 B1 20141201; KR 20080093451 A 20081021; PL 1979511 T3 20190531; US 2009324804 A1 20091231; WO 2007088008 A2 20070809; WO 2007088008 A3 20080417
DOCDB simple family (application)
EP 06002099 A 20060202; CN 200780011943 A 20070126; EP 07703047 A 20070126; EP 2007000658 W 20070126; ES 07703047 T 20070126; JP 2008552727 A 20070126; KR 20087021543 A 20080902; PL 07703047 T 20070126; US 27825607 A 20070126