EP 1817795 A1 20070815 - METALLISED FILM FOR SHEET CONTACTING
Title (en)
METALLISED FILM FOR SHEET CONTACTING
Title (de)
METALLISIERTE FOLIE ZUR FLÄCHIGEN KONTAKTIERUNG
Title (fr)
FEUILLE METALLISEE POUR ETABLISSEMENT DE CONTACT EN NAPPE
Publication
Application
Priority
- EP 2005056094 W 20051121
- DE 102004057494 A 20041129
Abstract (en)
[origin: WO2006058850A1] The invention relates to a method for contacting at least one electrical contact surface (1) on a surface of a substrate (2) and/or at least one component (3) arranged on the substrate (2), especially a semiconductor chip. Said method comprises the following steps: at least one insulating film (4) consisting of an electrically insulating plastic material is laminated, under a vacuum, onto the surfaces of the substrate (2) and the component comprising the contact surface (1); and the contact surface (1) to be contacted on the surfaces is bared by opening a window (6) in the insulating film (4). The invention is characterised by sheet contacting the bared contact surface (1) with at least one metallisation (5) on an insulating film (4).
IPC 8 full level
H01L 21/60 (2006.01); H01L 25/07 (2006.01)
CPC (source: EP US)
H01L 23/29 (2013.01 - EP US); H01L 23/36 (2013.01 - EP US); H01L 23/5387 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 25/072 (2013.01 - EP US); H01L 23/49811 (2013.01 - EP US); H01L 2224/2402 (2013.01 - EP US); H01L 2224/24051 (2013.01 - EP US); H01L 2224/24225 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2224/82039 (2013.01 - EP US); H01L 2224/82047 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US)
Citation (search report)
See references of WO 2006058850A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102004057494 A1 20060608; CN 100472783 C 20090325; CN 101061582 A 20071024; EP 1817795 A1 20070815; JP 2008522394 A 20080626; US 2008093727 A1 20080424; US 7910470 B2 20110322; WO 2006058850 A1 20060608
DOCDB simple family (application)
DE 102004057494 A 20041129; CN 200580039308 A 20051121; EP 05815728 A 20051121; EP 2005056094 W 20051121; JP 2007541966 A 20051121; US 79160805 A 20051121