EP 1824638 A1 20070829 - PB FREE SOLDER ALLOY
Title (en)
PB FREE SOLDER ALLOY
Title (de)
BLEIFREIE LOTLEGIERUNG
Title (fr)
ALLIAGE DE SOUDURE SANS PLOMB
Publication
Application
Priority
- KR 2005000305 W 20050202
- KR 20040092857 A 20041113
Abstract (en)
[origin: WO2006052049A1] The present invention relates to a solder alloy used for mounting or plating electronic components on a printed circuit board (PCB) and the like, and, more particularly, to a Pb-free Sn-Ag based solder alloy which comprises 0.1 ~ 3.0 wt% of Cu, 0.01 ~ 0.5 wt% of Ni, 0.01 ~ 5.0 wt% of Ag, and the balance of Sn. The Pb-free Sn-Ag based solder alloy of the invention has a lower melting point, and highly enhanced wettability and joining strength, compared with the conventional Pb-free solder alloy, thereby preventing generation of bridges.
IPC 8 full level
B23K 35/22 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP KR US)
B23K 35/22 (2013.01 - KR); B23K 35/262 (2013.01 - EP US); C22C 13/00 (2013.01 - EP US); H05K 3/3463 (2013.01 - EP US)
Designated contracting state (EPC)
DE GB NL
DOCDB simple family (publication)
WO 2006052049 A1 20060518; CN 101048258 A 20071003; EP 1824638 A1 20070829; EP 1824638 A4 20090708; JP 2008518791 A 20080605; KR 20050030237 A 20050329; US 2009129970 A1 20090521
DOCDB simple family (application)
KR 2005000305 W 20050202; CN 200580037289 A 20050202; EP 05726536 A 20050202; JP 2007540243 A 20050202; KR 20040092857 A 20041113; US 57792707 A 20070425