EP 1826285 A4 20090408 - MARTENSITIC STAINLESS STEEL
Title (en)
MARTENSITIC STAINLESS STEEL
Title (de)
MARTENSITISCHER NICHTROSTENDER STAHL
Title (fr)
ACIER INOXYDABLE MARTENSITIQUE
Publication
Application
Priority
- JP 2005019685 W 20051026
- JP 2004335241 A 20041119
Abstract (en)
[origin: EP1826285A1] Martensitic stainless steel according to the invention contains, by mass, 0.001% to 0.01% C, at most 0.5% Si, 0.1% to 3.0% Mn, at most 0.04% P, at most 0.01% S, 10% to 15% Cr, 4% to 8% Ni, 2.8% to 5.0% Mo, 0.001% to 0.10% Al, at most 0.07% N, 0% to 0.25% Ti, 0% to 0.25% V, 0% to 0.25% Nb, 0% to 0.25% Zr, 0% to 1.0% Cu, 0% to 0.005% Ca, 0% to 0.005% Mg, 0% to 0.005% La, and 0% to 0.005% Ce, with the balance being Fe and impurities, and the steel satisfies Expressions (1) and (2) and has a yield stress in the range from 758 MPa to 860 MPa. In this way, in the martensitic stainless steel according to the invention, the tempering temperature range at which a yield stress in the range from 758 MPa to 860 MPa can be obtained is increased, 922.6 - 554.5 ¢ C - 50.9 ¢ Mn + 2944.8 ¢ P + 1.056 ¢ Cr - 81.1 ¢ Ni + 95.8 ¢ Mo - 125.1 ¢ Ti 1584.9 ¢ A ¢ 1 376.1 ¢ N ¥ 600 30 ¢ C + 0.5 ¢ Mn + Ni + 0.5 ¢ Cu 1.5 ¢ Si Cr Mo + 7.9 ¥ 0
IPC 8 full level
C22C 38/00 (2006.01); C21D 6/00 (2006.01); C22C 38/58 (2006.01)
CPC (source: EP US)
C21D 1/25 (2013.01 - EP US); C21D 6/004 (2013.01 - EP US); C22C 38/02 (2013.01 - EP US); C22C 38/04 (2013.01 - EP US); C22C 38/44 (2013.01 - EP US); C21D 2211/008 (2013.01 - EP US)
Citation (search report)
- [X] JP H05156409 A 19930622 - NIPPON STEEL CORP
- [A] US 6129999 A 20001010 - UEDA MASAKATSU [JP], et al
- [PA] EP 1584699 A1 20051012 - SUMITOMO METAL IND [JP]
- [A] EP 1026273 A1 20000809 - SUMITOMO METAL IND [JP]
- [E] EP 1652950 A1 20060503 - SUMITOMO METAL IND [JP]
- [A] JP 2000192196 A 20000711 - SUMITOMO METAL IND
- See references of WO 2006054430A1
Designated contracting state (EPC)
DE FR
DOCDB simple family (publication)
EP 1826285 A1 20070829; EP 1826285 A4 20090408; EP 1826285 B1 20121003; CN 100549204 C 20091014; CN 101061245 A 20071024; JP 2006144069 A 20060608; JP 4337712 B2 20090930; US 2008213120 A1 20080904; WO 2006054430 A1 20060526
DOCDB simple family (application)
EP 05799225 A 20051026; CN 200580039655 A 20051026; JP 2004335241 A 20041119; JP 2005019685 W 20051026; US 79101505 A 20051026