EP 1829099 A1 20070905 - METHOD FOR TREATING THE SURFACE OF A WAFER
Title (en)
METHOD FOR TREATING THE SURFACE OF A WAFER
Title (de)
VERFAHREN ZUR BEHANDLUNG DER OBERFLÄCHE EINES WAFERS
Title (fr)
PROCEDE DE TRAITEMENT D'UNE SURFACE DE PLAQUETTE
Publication
Application
Priority
- EP 2005057003 W 20051221
- FR 0413930 A 20041224
- FR 0413922 A 20041224
Abstract (en)
[origin: US2006141746A1] The invention concerns a method of treating one or both bonding surfaces of first and second substrates and in particular, the surfaces of donor and receiver wafers that are intended to be bonded together. A simultaneous cleaning and activation step is carried out immediately prior to bonding the wafers together, by applying to one or both bonding surfaces an activation solution of ammonia (NH<SUB>4</SUB>OH) in water, preferably deionized, at a concentration by weight in the range from about 0.05% to 2%. The method is applicable to fabricating structures used in the optics, electronics, or optoelectronics fields.
IPC 8 full level
H01L 21/762 (2006.01)
CPC (source: EP KR US)
H01L 21/20 (2013.01 - KR); H01L 21/302 (2013.01 - KR); H01L 21/76251 (2013.01 - EP US)
Citation (search report)
See references of WO 2006069945A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2006141746 A1 20060629; US 7919391 B2 20110405; EP 1829099 A1 20070905; JP 2008526006 A 20080717; KR 100884672 B1 20090218; KR 20070088737 A 20070829; TW 200636906 A 20061016; TW I333258 B 20101111; WO 2006069945 A1 20060706
DOCDB simple family (application)
US 14545505 A 20050602; EP 05823924 A 20051221; EP 2005057003 W 20051221; JP 2007547504 A 20051221; KR 20077014457 A 20070625; TW 94145970 A 20051223