EP 1829100 A1 20070905 - METHOD FOR TRANSFERRING A CIRCUIT TO A GROUNDING PLANE
Title (en)
METHOD FOR TRANSFERRING A CIRCUIT TO A GROUNDING PLANE
Title (de)
VERFAHREN ZUM TRANSFER EINER SCHALTUNG ZU EINER MASSEVERBINDUNGSEBENE
Title (fr)
PROCEDE DE REPORT D'UN CIRCUIT SUR UN PLAN DE MASSE
Publication
Application
Priority
- FR 2005051139 W 20051222
- FR 0453229 A 20041224
Abstract (en)
[origin: FR2880189A1] The method involves producing a part of a circuit in or on a surface layer (2) of a substrate, where the substrate comprises a layer (4) buried under the surface layer and an underlying layer utilized in the form of a support. The substrate is transferred to a handle substrate. The underlying layer is removed, and a bonding layer (12) e.g. amorphous silicon layer, is formed on an electrically conductive or a grounding plane forming layer (14). The layer has a thickness of 100 nm. An assembly is transferred to a substrate (30), and the handle substrate is removed.
IPC 8 full level
H01L 21/762 (2006.01)
CPC (source: EP KR US)
H01L 21/762 (2013.01 - KR); H01L 21/76256 (2013.01 - EP US); H01L 27/12 (2013.01 - KR)
Citation (search report)
See references of WO 2006070167A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2880189 A1 20060630; FR 2880189 B1 20070330; CN 100543962 C 20090923; CN 101088153 A 20071212; EP 1829100 A1 20070905; JP 2008526009 A 20080717; KR 20070086316 A 20070827; US 2008128868 A1 20080605; US 8298915 B2 20121030; WO 2006070167 A1 20060706
DOCDB simple family (application)
FR 0453229 A 20041224; CN 200580044396 A 20051222; EP 05848368 A 20051222; FR 2005051139 W 20051222; JP 2007547604 A 20051222; KR 20077013647 A 20070615; US 79386305 A 20051222