Global Patent Index - EP 1832619 A4

EP 1832619 A4 20090429 - BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE

Title (en)

BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE

Title (de)

BENZOXAZOLHARZVORSTUFE, POLYBENZOXAZOLHARZ, HARZFILM UND HALBLEITERVORRICHTUNG

Title (fr)

PRÉCURSEUR DE RÉSINE DE TYPE BENZOXAZOLE, RÉSINE POLYBENZOXAZOLE, FILM DE RÉSINE, ET DISPOSITIF SEMI-CONDUCTEUR

Publication

EP 1832619 A4 20090429 (EN)

Application

EP 05753429 A 20050620

Priority

  • JP 2005011688 W 20050620
  • JP 2004380154 A 20041228
  • JP 2005058093 A 20050302

Abstract (en)

[origin: EP1832619A1] A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

IPC 8 full level

C08G 73/22 (2006.01); H01L 21/312 (2006.01)

CPC (source: EP KR US)

C08G 73/22 (2013.01 - EP KR US); H01L 21/02118 (2013.01 - EP KR US); H01L 21/02205 (2013.01 - EP KR US); H01L 21/312 (2016.02 - US); Y10T 428/249991 (2015.04 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 1832619 A1 20070912; EP 1832619 A4 20090429; CN 101128514 A 20080220; CN 101128514 B 20110525; KR 101199664 B1 20121108; KR 20070100333 A 20071010; US 2008206548 A1 20080828; US 8337982 B2 20121225; WO 2006070498 A1 20060706

DOCDB simple family (application)

EP 05753429 A 20050620; CN 200580048670 A 20050620; JP 2005011688 W 20050620; KR 20077017174 A 20050620; US 72262505 A 20050620