EP 1838639 A1 20071003 - PRINTABLE MEDIUM FOR THE ETCHING OF SILICON DIOXIDE AND SILICON NITRIDE LAYERS
Title (en)
PRINTABLE MEDIUM FOR THE ETCHING OF SILICON DIOXIDE AND SILICON NITRIDE LAYERS
Title (de)
DRUCKF[HIGES MEDIUM ZUR ÄTZUNG VON SILIZIUMDIOXID- UND SILIZIUMNITRIDSCHICHTEN
Title (fr)
AGENT POUVANT ETRE APPLIQUE PAR IMPRESSION POUR L'ATTAQUE DE COUCHES DE DIOXYDE DE SILICIUM ET DE NITRURE DE SILICIUM
Publication
Application
Priority
- EP 2005013657 W 20051219
- DE 102005001343 A 20050111
- DE 102005007743 A 20050218
Abstract (en)
[origin: WO2006074791A1] The invention relates to a novel printable etching medium, with non-Newtonian flow properties for the etching of surfaces in the production of solar cells and the use thereof. The invention particularly relates to corresponding particle-containing compositions, by means of which the very selective fine structures can be etched without damaging or attacking adjacent surfaces.
IPC 8 full level
C03C 15/00 (2006.01)
CPC (source: EP KR US)
C03C 15/00 (2013.01 - EP KR US); C09K 13/04 (2013.01 - EP KR US); C23F 1/16 (2013.01 - KR); H01L 21/311 (2013.01 - KR); H01L 21/31111 (2013.01 - EP US); H01L 31/1804 (2013.01 - EP US); Y02E 10/547 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Citation (search report)
See references of WO 2006074791A1
Citation (examination)
WO 2005050673 A1 20050602 - MERCK PATENT GMBH [DE], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102005007743 A1 20060720; EP 1838639 A1 20071003; JP 2008527698 A 20080724; JP 5107722 B2 20121226; KR 20070102510 A 20071018; KR 20130054421 A 20130524; MY 146508 A 20120815; TW 200700340 A 20070101; TW I315724 B 20091011; US 2008121621 A1 20080529; US 7837890 B2 20101123; WO 2006074791 A1 20060720
DOCDB simple family (application)
DE 102005007743 A 20050218; EP 05818404 A 20051219; EP 2005013657 W 20051219; JP 2007549813 A 20051219; KR 20077015825 A 20070711; KR 20137009071 A 20051219; MY PI20060084 A 20060109; TW 95101114 A 20060111; US 81363205 A 20051219