Global Patent Index - EP 1838892 A1

EP 1838892 A1 20071003 - METHOD AND DEVICE FOR HOT-DIP COATING A METAL STRIP

Title (en)

METHOD AND DEVICE FOR HOT-DIP COATING A METAL STRIP

Title (de)

VERFAHREN UND VORRICHTUNG ZUR SCHMELZTAUCHBESCHICHTUNG EINES METALLBANDES

Title (fr)

PROCEDE ET DISPOSITIF DE METALLISATION PAR TREMPE D'UNE BANDE METALLIQUE

Publication

EP 1838892 A1 20071003 (DE)

Application

EP 06762294 A 20060630

Priority

  • EP 2006006350 W 20060630
  • DE 102005030772 A 20050701
  • DE 102005033288 A 20050716

Abstract (en)

[origin: US2008145569A1] The invention relates to a method for hot-dip coating a metal strip ( 1 ), particularly a steel strip, in which the metal strip ( 1 ) is fed to a receptacle ( 5 ) accommodating the melted coating metal ( 4 ) through a hole ( 6 ) in the bottom area of the receptacle ( 5 ) after passing through a furnace ( 2 ) and a roll chamber ( 3 ) that adjoins the furnace ( 2 ) in the direction of travel (F) of the metal strip ( 1 ). An electromagnetic field is generated in the bottom area of the receptacle ( 5 ) so as to retain the coating metal ( 4 ) in the receptacle ( 5 ). In order to obtain more advantageous operating conditions especially in case the performance of the hot-dip coating system drops, different gas atmospheres are maintained in at least two separate spaces ( 7, 8 ) of the roll chamber ( 3 ). The invention further relates to a hot-dip coating device.

IPC 8 full level

C23C 2/02 (2006.01); C23C 2/36 (2006.01)

CPC (source: EP KR US)

C23C 2/0035 (2022.08 - EP KR US); C23C 2/00362 (2022.08 - EP KR US); C23C 2/0038 (2022.08 - EP KR US); C23C 2/02 (2013.01 - EP US); C23C 2/022 (2022.08 - EP KR US); C23C 2/06 (2013.01 - KR); C23C 2/24 (2013.01 - KR); C23C 2/36 (2013.01 - EP KR US); C23C 2/40 (2013.01 - KR); C23C 2/52 (2022.08 - EP KR US)

Citation (search report)

See references of WO 2007003357A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

US 2008145569 A1 20080619; AT E417138 T1 20081215; AU 2006265394 A1 20070111; AU 2006265394 B2 20091029; BR PI0609611 A2 20100420; CN 101384746 A 20090311; CN 101384746 B 20110706; DE 102005033288 A1 20070104; DE 502006002323 D1 20090122; EP 1838892 A1 20071003; EP 1838892 B1 20081210; ES 2316081 T3 20090401; JP 2008542539 A 20081127; JP 4733179 B2 20110727; KR 100941626 B1 20100211; KR 20070102601 A 20071018; MX 2007012579 A 20071210; MY 141758 A 20100630; PL 1838892 T3 20090529; RU 2007136479 A 20090410; RU 2358033 C1 20090610; TW 200702489 A 20070116; WO 2007003357 A1 20070111

DOCDB simple family (application)

US 88441606 A 20060630; AT 06762294 T 20060630; AU 2006265394 A 20060630; BR PI0609611 A 20060630; CN 200680009169 A 20060630; DE 102005033288 A 20050716; DE 502006002323 T 20060630; EP 06762294 A 20060630; EP 2006006350 W 20060630; ES 06762294 T 20060630; JP 2008514037 A 20060630; KR 20077020356 A 20060630; MX 2007012579 A 20060630; MY PI20063154 A 20060703; PL 06762294 T 20060630; RU 2007136479 A 20060630; TW 95123775 A 20060630