Global Patent Index - EP 1841659 A1

EP 1841659 A1 20071010 - Material packaging system

Title (en)

Material packaging system

Title (de)

Materialverpackungssystem

Title (fr)

Système de conditionnement de matériau

Publication

EP 1841659 A1 20071010 (EN)

Application

EP 05711877 A 20050124

Priority

US 2005002117 W 20050124

Abstract (en)

[origin: WO2006080906A1] An improved material packaging system includes a plurality of nested liners removably attached to each other to form a unitary liner structure and a receptacle having a circumferential attachment lip for detachably securing said unitary liner structure to said receptacle. The unitary liner structure has an elastic attachment device for detachably securing the unitary liner structure to the receptacle attachment device by expanding the elastic attachment device circumferentially, fitting the elastic attachment device over the attachment lip and into a position below the attachment lip, and releasing the elastic attachment device to permit the elastic attachment device to compressibly mate with the receptacle below the attachment lip. Each of the liners has a pull grip for gripping the liner to remove the liner from the unitary liner structure and perforations disposed between the pull grip and the elastic attachment device for tearing the liner when a tearing force is applied thereto.

IPC 8 full level

B65D 35/14 (2006.01)

CPC (source: EP)

B65D 33/001 (2013.01); B65F 1/062 (2013.01); B65F 2220/12 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2006080906 A1 20060803; AT E501944 T1 20110415; CN 100584705 C 20100127; CN 101128363 A 20080220; DE 602005026997 D1 20110428; EP 1841659 A1 20071010; EP 1841659 A4 20090520; EP 1841659 B1 20110316

DOCDB simple family (application)

US 2005002117 W 20050124; AT 05711877 T 20050124; CN 200580048667 A 20050124; DE 602005026997 T 20050124; EP 05711877 A 20050124