Global Patent Index - EP 1841665 A1

EP 1841665 A1 20071010 - BEND AND PEEL WITH SCORE UNDER THE TABS

Title (en)

BEND AND PEEL WITH SCORE UNDER THE TABS

Title (de)

BIEGEN UND ABZIEHEN MIT RITZLINIE UNTER DEN LASCHEN

Title (fr)

EMBALLAGE A PILER ET DECOLLER PRESENTANT UNE MARQUE SOUS LES LANGUETTES

Publication

EP 1841665 A1 20071010 (EN)

Application

EP 05706411 A 20050125

Priority

CA 2005000081 W 20050125

Abstract (en)

[origin: WO2006079192A1] A bend and peel child resistant and senior friendly tamper evident package comprising a blister sheet having blister pockets projecting from a front side thereof, a rupturable foil layer being adhered to the blister layer and reinforcing the paperboard material adhered to the foil layer, the paperboard layer having a tear strip formed therein, the tear strip being defined by a cut into the paperboard layer from the side thereof adhered to the foil layer, the cut extending only a certain percentage of the total thickness of the paperboard such that a controlled delamination of the paperboard layer occurs when the tear strip is removed. This provides a precise reinforcement of the foil layer.

IPC 8 full level

B65D 75/36 (2006.01); A61J 1/00 (2006.01); B32B 15/12 (2006.01); B65D 50/00 (2006.01); B65D 55/02 (2006.01); B65D 55/06 (2006.01); B65D 75/32 (2006.01); B65D 75/34 (2006.01)

CPC (source: EP)

B65D 75/327 (2013.01); B65D 75/367 (2013.01); B65D 2215/04 (2013.01); B65D 2575/3236 (2013.01); B65D 2575/367 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2006079192 A1 20060803; AU 2005325783 A1 20060803; EP 1841665 A1 20071010; EP 1841665 A4 20130626

DOCDB simple family (application)

CA 2005000081 W 20050125; AU 2005325783 A 20050125; EP 05706411 A 20050125