EP 1846875 A1 20071024 - METHOD OF PRODUCING A CONTACTLESS MICROELECTRONIC DEVICE, SUCH AS FOR AN ELECTRONIC PASSPORT
Title (en)
METHOD OF PRODUCING A CONTACTLESS MICROELECTRONIC DEVICE, SUCH AS FOR AN ELECTRONIC PASSPORT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER KONTAKTLOSEN MIKROELEKTRONISCHEN EINRICHTUNG, ZUM BEISPIEL FÜR EINEN ELEKTRONISCHEN PASS
Title (fr)
PROCEDE DE FABRICATION D'UN DISPOSITIF MICRO-ELECTRONIQUE A FONCTIONNEMENT SANS CONTACT, NOTAMMENT POUR PASSEPORT ELECTRONIQUE
Publication
Application
Priority
- FR 2006000271 W 20060203
- FR 0501378 A 20050211
Abstract (en)
[origin: WO2006084984A1] The invention relates to a method of producing a contactless microelectronic device, such as for an electronic passport. The inventive method comprises the following steps consisting in: forming an antenna (27) on a thin, flexible substrate (21); placing a perforated sheet (22) comprising at least one cavity (23) in the thickness thereof on the aforementioned substrate (21); depositing a microelectronic chip (24) in each cavity (23) in the perforated sheet (22) and electrically connecting the output studs (25) of the microelectronic chip to the corresponding terminals (26) of the antenna (27); and protecting the microelectronic chip (24) thus wired by sealing the cavity (23) housing the chip. The method is characterised in that the thin, flexible substrate (21) and the perforated sheet (22) each have a thin, calibrated, essentially-uniform and flat thickness, the sum of the thicknesses thereof being less than approximately 350 micrometers and the thickness of the perforated sheet (22) being constant and slightly greater than the thickness of the microelectronic chip (24). In this way, the end product produced is perfectly flat and free of blisters.
IPC 8 full level
G06K 19/077 (2006.01)
CPC (source: EP US)
G06K 19/07749 (2013.01 - EP US); G06K 19/07758 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/97 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US)
Citation (search report)
See references of WO 2006084984A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2882174 A1 20060818; FR 2882174 B1 20070907; CN 101203869 A 20080618; CN 101203869 B 20160330; EP 1846875 A1 20071024; MA 29314 B1 20080303; RU 2007133794 A 20090320; RU 2464635 C2 20121020; US 2009057414 A1 20090305; US 7992790 B2 20110809; WO 2006084984 A1 20060817
DOCDB simple family (application)
FR 0501378 A 20050211; CN 200680011238 A 20060203; EP 06709260 A 20060203; FR 2006000271 W 20060203; MA 30189 A 20070831; RU 2007133794 A 20060203; US 88412306 A 20060203