Global Patent Index - EP 1846950 A2

EP 1846950 A2 20071024 - ELECTRONIC COMPONENT PROTECTED AGAINST THE ATTACKS

Title (en)

ELECTRONIC COMPONENT PROTECTED AGAINST THE ATTACKS

Title (de)

ELEKTRONISCHE KOMPONENTE MIT SCHUTZ VOR ANGRIFFEN

Title (fr)

PROCEDE DE FABRICATION D'UN COMPOSANT ELCTRONIQUE DE TRANCHE DE SILICUM PROTEGE CONTRE LES ATTAQUES, ET CE COMPOSANT

Publication

EP 1846950 A2 20071024 (EN)

Application

EP 06744419 A 20060207

Priority

  • IB 2006000229 W 20060207
  • EP 05290316 A 20050211
  • EP 06744419 A 20060207

Abstract (en)

[origin: EP1691413A1] The method involves providing a P doped material inclusion (18) that destroys or damages an electronic component e.g. microcontroller, in case of a thinning attempt of a silicon wafer of the component by a rear side (17) of a silicon substrate (15). The inclusion acts on the polarization of the wafer. The silicon wafer is polarized by the rear side. The wafer is tested with a polarization of the substrate. An independent claim is also included for a chip card comprising an electronic component.

IPC 8 full level

H01L 23/58 (2006.01); H01L 27/02 (2006.01)

CPC (source: EP KR US)

G06K 19/07372 (2013.01 - EP US); H01L 23/49855 (2013.01 - EP US); H01L 23/576 (2013.01 - EP US); H01L 23/58 (2013.01 - KR); H01L 27/02 (2013.01 - EP KR US); H01L 2924/0002 (2013.01 - EP US)

Citation (search report)

See references of WO 2006085188A2

Citation (examination)

US 6753239 B1 20040622 - CONN ROBERT O [US]

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 1691413 A1 20060816; CN 101107709 A 20080116; CN 101107709 B 20120328; EP 1846950 A2 20071024; JP 2008530791 A 20080807; JP 5070065 B2 20121107; KR 101219898 B1 20130118; KR 20070100731 A 20071011; US 2008286944 A1 20081120; US 8330261 B2 20121211; WO 2006085188 A2 20060817; WO 2006085188 A3 20060928

DOCDB simple family (application)

EP 05290316 A 20050211; CN 200680002687 A 20060207; EP 06744419 A 20060207; IB 2006000229 W 20060207; JP 2007554666 A 20060207; KR 20077015805 A 20060207; US 88370106 A 20060207