EP 1848774 A1 20071031 - TRANSPARENT MOULDING COMPOUND
Title (en)
TRANSPARENT MOULDING COMPOUND
Title (de)
TRANSPARENTE FORMMASSE
Title (fr)
MATIERE A MOULER TRANSPARENTE
Publication
Application
Priority
- EP 2006050036 W 20060104
- DE 102005007664 A 20050219
Abstract (en)
[origin: WO2006087248A1] The invention relates to a moulding compound containing the following components: (a) a partially crystalline copolyamide, and (b) an effective amount of a crystallisation auxiliary selected from nanoscale fillers and metal salts, metal oxides and metal hydroxides that can react with the carboxyl terminal groups of the copolyamide. The copolyamide can be produced from the following combination of monomers: a) 50 to 99 mol. % of a lactam or a corresponding ?-aminocarboxylic acid with 8, 9, 10, 11 or 12 carbon atoms or an essentially equimolar mixture of a diamine and a dicarboxylic acid, the diamine being selected from the group comprising 1.6-hexamethylene diamine, 1.8-octamethylene diamine, 1.10-decamethylene diamine and 1.12-dodecamethylene diamine and the dicarboxylic acid being selected from the group comprising sebacic acid and 1.12-dodecanedioic acid, and (ß) 1 to 50 mol. % of an essentially equimolar mixture of a diamine and a dicarboxylic acid, where either the diamine or the dicarboxylic acid or both differ from, respectively, the diamine used in a) and the dicarboxylic acid used in a), or of another lactam or the corresponding ?-aminocarboxylic acid. The moulding compound is transparent and readily workable, and can be decorated using screen printing techniques.
IPC 8 full level
C08L 77/04 (2006.01)
CPC (source: EP US)
C08G 69/08 (2013.01 - EP US); C08G 69/265 (2013.01 - EP US); C08G 69/36 (2013.01 - EP US); C08J 5/18 (2013.01 - EP US); C08L 77/04 (2013.01 - EP US); C08L 77/06 (2013.01 - EP US); C08J 2377/00 (2013.01 - EP US); Y10T 428/24802 (2015.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006087248 A1 20060824; CN 1821305 A 20060823; DE 102005007664 A1 20060831; EP 1848774 A1 20071031; JP 2008530325 A 20080807; TW 200806741 A 20080201; US 2008166529 A1 20080710
DOCDB simple family (application)
EP 2006050036 W 20060104; CN 200610009052 A 20060217; DE 102005007664 A 20050219; EP 06700749 A 20060104; JP 2007555562 A 20060104; TW 95127536 A 20060727; US 81659506 A 20060104