EP 1849341 A2 20071031 - METHOD AND DEVICE FOR CONNECTING SEMICONDUCTOR OR INTERPOSER COMPONENTS TO A SUPPORTING STRIP AND THE USE OF SAID DEVICE
Title (en)
METHOD AND DEVICE FOR CONNECTING SEMICONDUCTOR OR INTERPOSER COMPONENTS TO A SUPPORTING STRIP AND THE USE OF SAID DEVICE
Title (de)
VERFAHREN UND VORRICHTUNG ZUM VERBINDEN VON HALBLEITERELEMENTEN ODER INTERPOSERN MIT EINEM TRÄGERBAND UND VERWENDUNG EINER DERARTIGEN VORRICHTUNG
Title (fr)
PROCEDE ET DISPOSITIF POUR RELIER DES ELEMENTS A SEMI-CONDUCTEURS OU DES INTERPOSEURS A UNE BANDE SUPPORT ET UTILISATION D'UN TEL DISPOSITIF
Publication
Application
Priority
- EP 2006050866 W 20060213
- DE 102005006978 A 20050215
Abstract (en)
[origin: DE102005006978B3] Method for joining semiconductor components (2) with a flexible support band (1) comprises moving an endless band parallel to the running direction (5) of the support band between first heating elements (7a-7c) and the semiconductor components and between a second heating element and the semiconductor components whilst the first heating elements exert a first pressure using a spring action. An independent claim is also included for a device for joining semiconductor components with a flexible support band.
IPC 8 full level
H05K 13/00 (2006.01)
CPC (source: EP)
H01L 21/67109 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H05K 13/003 (2013.01); H01L 2224/75 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01)
Citation (search report)
See references of WO 2006087301A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102005006978 B3 20060608; EP 1849341 A2 20071031; WO 2006087301 A2 20060824; WO 2006087301 A3 20061207
DOCDB simple family (application)
DE 102005006978 A 20050215; EP 06708208 A 20060213; EP 2006050866 W 20060213