EP 1852900 A1 20071107 - CARRIER FOR DOUBLE SIDE POLISHING MACHINE AND DOUBLE SIDE POLISHING MACHINE EMPLOYING IT, AND DOUBLE SIDE POLISHING METHOD
Title (en)
CARRIER FOR DOUBLE SIDE POLISHING MACHINE AND DOUBLE SIDE POLISHING MACHINE EMPLOYING IT, AND DOUBLE SIDE POLISHING METHOD
Title (de)
TRÄGER FÜR EINE DOPPELSEITIGE POLIERMASCHINE UND DIESEN VERWENDENDE DOPPELSEITIGE POLIERMASCHINE UND VERFAHREN ZUM DOPPELSEITIGEN POLIEREN
Title (fr)
PORTEUR POUR MACHINE DE POLISSAGE DOUBLE FACE, MACHINE DE POLISSAGE DOUBLE FACE UTILISANT LE DIT PORTEUR ET PROCEDE DE POLISSAGE DOUBLE FACE
Publication
Application
Priority
- JP 2006302943 W 20060220
- JP 2005049933 A 20050225
Abstract (en)
The present invention is a carrier for a double-side polishing apparatus in which, in a double-side polishing apparatus, the carrier is set between upper and lower turn tables to which polishing pads are attached, and a holding hole to hold a wafer sandwiched between the upper and lower turn tables in polishing is formed in the carrier, wherein the carrier is made of titanium. Thereby, there is provided a carrier for a double-side polishing apparatus in which the strength of the carrier itself is high, and at the same time, contamination of a wafer such as a silicon wafer by impurities is suppressed, and sag in a peripheral portion of the wafer after being polished is suppressed.
IPC 8 full level
H01L 21/304 (2006.01); B24B 37/28 (2012.01)
CPC (source: EP KR)
B24B 37/28 (2013.01 - EP); H01L 21/304 (2013.01 - KR)
Designated contracting state (EPC)
DE FR
DOCDB simple family (publication)
EP 1852900 A1 20071107; EP 1852900 A4 20090121; EP 1852900 B1 20110921; CN 100481341 C 20090422; CN 101128920 A 20080220; JP WO2006090661 A1 20080724; KR 101193406 B1 20121024; KR 20070110033 A 20071115; WO 2006090661 A1 20060831
DOCDB simple family (application)
EP 06714084 A 20060220; CN 200680005678 A 20060220; JP 2006302943 W 20060220; JP 2007504699 A 20060220; KR 20077019071 A 20060220