Global Patent Index - EP 1856309 A4

EP 1856309 A4 20091028 - SELECTIVE CATALYTIC ACTIVATION OF NON-CONDUCTIVE SUBSTRATES

Title (en)

SELECTIVE CATALYTIC ACTIVATION OF NON-CONDUCTIVE SUBSTRATES

Title (de)

SELEKTIVE KATALYTISCHE AKTIVIERUNG NICHTLEITENDER SUBSTRATE

Title (fr)

ACTIVATION CATALYTIQUE SELECTIVE DE SUBSTRATS NON CONDUCTIFS

Publication

EP 1856309 A4 20091028 (EN)

Application

EP 06734240 A 20060202

Priority

  • US 2006003730 W 20060202
  • US 4982805 A 20050203

Abstract (en)

[origin: US2005241951A1] A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles, for creating circuitry for smart cards, such as phone cards, and for providing electromagnetic shielding of electronic devices is provided. The method comprises the steps of catalyzing the non-conductive substrate by applying a catalytic ink, reducing a source of catalytic metal ions in the catalytic ink to its associated metal, depositing electroless metal on the pattern of catalytic ink on the surface of the substrate; and plating electrolytic metal on the electroless metal layer to produce the desired pattern of metal on the non-conductive substrate. The catalytic ink typically comprises one or more solvents, a source of catalytic metal ions, a crosslinking agent, one or more copolymers, a polyurethane polymer, and, optionally, one or more fillers.

IPC 8 full level

C23C 18/16 (2006.01); C23C 18/28 (2006.01); C23C 18/30 (2006.01); C25D 5/02 (2006.01); C25D 5/56 (2006.01); H05K 3/18 (2006.01)

CPC (source: EP US)

C23C 18/1608 (2013.01 - EP US); C23C 18/208 (2013.01 - EP US); C23C 18/30 (2013.01 - EP US); C23C 18/31 (2013.01 - EP US); H01Q 1/2225 (2013.01 - EP US); H01Q 7/00 (2013.01 - EP US); H05K 3/182 (2013.01 - EP US); C23C 18/1653 (2013.01 - EP US); C25D 5/56 (2013.01 - EP US); H05K 2203/0709 (2013.01 - EP US); H05K 2203/1157 (2013.01 - EP US)

Citation (search report)

Citation (examination)

Designated contracting state (EPC)

DE ES FR GB IT

DOCDB simple family (publication)

US 2005241951 A1 20051103; BR PI0607133 A2 20090804; BR PI0607133 B1 20161129; CN 101142343 A 20080312; EP 1856309 A2 20071121; EP 1856309 A4 20091028; JP 2008528812 A 20080731; WO 2006084064 A2 20060810; WO 2006084064 A3 20071025

DOCDB simple family (application)

US 4982805 A 20050203; BR PI0607133 A 20060202; CN 200680002175 A 20060202; EP 06734240 A 20060202; JP 2007554216 A 20060202; US 2006003730 W 20060202