EP 1856729 A1 20071121 - METHOD FOR ESTABLISHING AN ELECTRICAL AND MECHANICAL CONNECTION BETWEEN CHIP CONTACT SURFACES AND ANTENNA CONTACT SURFACES AND TRANSPONDER
Title (en)
METHOD FOR ESTABLISHING AN ELECTRICAL AND MECHANICAL CONNECTION BETWEEN CHIP CONTACT SURFACES AND ANTENNA CONTACT SURFACES AND TRANSPONDER
Title (de)
VERFAHREN ZUM ELEKTRISCHEN UND MECHANISCHEM VERBINDEN VON CHIPANSCHLUSSFLÄCHEN MIT ANTENNENANSCHLUSSFLÄCHEN UND TRANSPONDER
Title (fr)
PROCEDE POUR ETABLIR UNE LIAISON ELECTRIQUE ET MECANIQUE ENTRE DES PASTILLES DE PUCE ET DES PASTILLES D'ANTENNE ET TRANSPONDEUR
Publication
Application
Priority
- EP 2006060536 W 20060308
- DE 102005011186 A 20050309
- DE 102005016930 A 20050413
Abstract (en)
[origin: DE102005016930A1] The method involves hooking contact surfaces (11, 12) of a chip, having a set of wire-shaped hooks/lugs (13) on their surfaces, with contact surfaces (19, 20) of a strip substrate, having a set of hooks/ lugs (16) on their surfaces, by applying pressure on the surfaces (19, 20). An RFID antenna is arranged on the substrate. Electrically conducting wires are used as a material for the hooks/lugs with a size in a nanometer range.
IPC 8 full level
H01L 21/60 (2006.01); G06K 19/077 (2006.01); H01L 23/498 (2006.01); H01R 12/57 (2011.01)
CPC (source: EP US)
H01L 23/49811 (2013.01 - EP US); H01L 23/49855 (2013.01 - EP US); H01L 24/05 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H01L 24/72 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H05K 3/325 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/81345 (2013.01 - EP US); H01L 2224/81385 (2013.01 - EP US); H01L 2224/81897 (2013.01 - EP US); H01L 2224/83897 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01R 4/26 (2013.01 - EP US); H05K 2201/10674 (2013.01 - EP US); H05K 2201/209 (2013.01 - EP US)
Citation (search report)
See references of WO 2006094989A1
Citation (examination)
US 2003136503 A1 20030724 - GREEN ALAN [US], et al
Designated contracting state (EPC)
AT CH DE FR GB LI
DOCDB simple family (publication)
DE 102005016930 A1 20060921; EP 1856729 A1 20071121; JP 2008532158 A 20080814; US 2008191944 A1 20080814; WO 2006094989 A1 20060914
DOCDB simple family (application)
DE 102005016930 A 20050413; EP 06724965 A 20060308; EP 2006060536 W 20060308; JP 2007557524 A 20060308; US 88590706 A 20060308