EP 1861872 A1 20071205 - METHOD FOR LINKING A CHIP AND A SUBSTRATE
Title (en)
METHOD FOR LINKING A CHIP AND A SUBSTRATE
Title (de)
VERFAHREN ZUM VERBINDEN EINES CHIPS UND EINES SUBSTRATS
Title (fr)
PROCEDE DE CONNEXION D'UNE PUCE ET D'UN SUBSTRAT
Publication
Application
Priority
EP 2005003170 W 20050324
Abstract (en)
[origin: WO2006099885A1] The invention relates to a method for linking a chip (10) and a substrate (20),which comprises initially providing an adhesive (30) including conducting particles. The chip (10) and the substrate (20) each comprises at least one contact surface (12, 14, 16, 22, 24, 26) on a corresponding face (18). The adhesive (30) is applied to one face of the substrate (20) or to one face of the chip (10), and the chip (10) and the substrate (20) are brought into contact with each other while aligning the contact surfaces. The arrangement is impinged upon with pressure in such a manner that the adhesive is locally densified in the area between the contact surfaces of the chip and the substrate and the conducting particles adhere to the contact surfaces. The adhesive (30) is finally cured.
IPC 8 full level
H01L 21/60 (2006.01)
CPC (source: EP)
H01L 24/29 (2013.01); H01L 24/83 (2013.01); H05K 3/323 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19043 (2013.01); H05K 2203/0278 (2013.01)
Citation (search report)
See references of WO 2006099885A1
Citation (examination)
- FEIL M. ET AL: "The challenge of ultra thin chip assembly", ELECTRONIC COMPONENTS AND TECHNOLOGY,, vol. 1, 1 June 2004 (2004-06-01), ECTC '04. PROCEEDINGS LAS VEGAS, NV, USA, pages 35 - 40
- LIONG S. ET AL: "CONDUCTIVITY IMPROVEMENT OF THERMOPLASTIC ISOTROPICALLY CONDUCTIVE ADHESIVE", PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 28 May 2002 (2002-05-28), SAN DIEGO, CA, pages 1140 - 1146, XP001210988
Designated contracting state (EPC)
FR NL
DOCDB simple family (publication)
DOCDB simple family (application)
EP 2005003170 W 20050324; EP 05716368 A 20050324