Global Patent Index - EP 1864197 A1

EP 1864197 A1 20071212 - HOUSING FOR A COMPUTER

Title (en)

HOUSING FOR A COMPUTER

Title (de)

GEHÄUSE FÜR EINEN COMPUTER

Title (fr)

BOITIER D'ORDINATEUR

Publication

EP 1864197 A1 20071212 (DE)

Application

EP 06723872 A 20060330

Priority

  • EP 2006002906 W 20060330
  • DE 102005014534 A 20050330

Abstract (en)

[origin: WO2006103072A1] The invention relates to a housing for a computer or multi-media equipment or similar comprising at least one heat-generating component, said housing having a respective cooling body on opposing walls and a heat conduction conduit that is thermally coupled to the heat-generating component. The housing is characterised in that the heat conduction conduit runs along both opposing walls and is thermally coupled to the cooling bodies, whereby heat from the heat-generating component can be dissipated from the housing via the heat conduction conduit and the cooling bodies. By running the heat conduction conduit along opposing walls, heat is transferred in a rapid, uniform manner to the entire surface of the cooling bodies that are contained in the walls.

IPC 8 full level

G06F 1/20 (2006.01)

CPC (source: EP US)

G06F 1/181 (2013.01 - EP US); G06F 1/20 (2013.01 - EP US); G06F 2200/201 (2013.01 - EP US)

Citation (search report)

See references of WO 2006103072A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

DE 102005014534 A1 20061005; CN 101198921 A 20080611; EP 1864197 A1 20071212; JP 2008537819 A 20080925; TW 200707167 A 20070216; US 2009213537 A1 20090827; WO 2006103072 A1 20061005

DOCDB simple family (application)

DE 102005014534 A 20050330; CN 200680019300 A 20060330; EP 06723872 A 20060330; EP 2006002906 W 20060330; JP 2008503425 A 20060330; TW 95110666 A 20060328; US 88741906 A 20060330