Global Patent Index - EP 1867224 A2

EP 1867224 A2 20071219 - COOLING DEVICE FOR PRINTED CIRCUIT BOARDS AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

COOLING DEVICE FOR PRINTED CIRCUIT BOARDS AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

KÜHLVORRICHTUNG FÜR LEITERPLATTEN UND VERFAHREN ZUR HERSTELLUNG DERSELBEN

Title (fr)

DISPOSITIF DE REFROIDISSEMENT POUR CARTES DE CIRCUITS ET PROCEDE DE PRODUCTION DE CE DISPOSITIF

Publication

EP 1867224 A2 20071219 (DE)

Application

EP 06705989 A 20060218

Priority

  • DE 2006000305 W 20060218
  • DE 102005015749 A 20050406

Abstract (en)

[origin: WO2006105746A2] The invention relates to a cooling device (1) for a printed circuit board (2) which is disposed in a housing (3) and can be connected in a locking manner to a metal cooling element (4) that is embodied as a cover of said housing (3).

IPC 8 full level

B60R 16/023 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP US)

H05K 7/1417 (2013.01 - EP US); H05K 7/142 (2013.01 - EP US); H05K 7/20436 (2013.01 - EP US); H05K 7/20854 (2013.01 - EP US); Y10T 29/49124 (2015.01 - EP US)

Citation (search report)

See references of WO 2006105746A2

Designated contracting state (EPC)

DE FR IT

DOCDB simple family (publication)

WO 2006105746 A2 20061012; WO 2006105746 A3 20070426; DE 102005015749 A1 20061012; DE 112006000163 A5 20071011; EP 1867224 A2 20071219; US 2009122494 A1 20090514

DOCDB simple family (application)

DE 2006000305 W 20060218; DE 102005015749 A 20050406; DE 112006000163 T 20060218; EP 06705989 A 20060218; US 91807506 A 20060218