EP 1869528 A1 20071226 - PROCESS FOR FORMING MICROSTRUCTURES
Title (en)
PROCESS FOR FORMING MICROSTRUCTURES
Title (de)
PROZESS ZUR BILDUNG VON MIKROSTRUKTUREN
Title (fr)
PROCEDE DE FORMATION DE MICROSTRUCTURES
Publication
Application
Priority
- US 2005041661 W 20051118
- US 1991204 A 20041221
- US 10298205 A 20050411
Abstract (en)
[origin: US2006134820A1] The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.
IPC 8 full level
B81C 1/00 (2006.01)
CPC (source: EP US)
B81C 1/00436 (2013.01 - EP US); B81C 1/00666 (2013.01 - EP US); B81C 2201/0107 (2013.01 - EP US); B81C 2201/0197 (2013.01 - EP US)
Citation (search report)
See references of WO 2006068737A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2006134820 A1 20060622; US 7271022 B2 20070918; EP 1869528 A1 20071226; TW 200626490 A 20060801; TW I291452 B 20071221; WO 2006068737 A1 20060629
DOCDB simple family (application)
US 10298205 A 20050411; EP 05845202 A 20051118; TW 94143810 A 20051212; US 2005041661 W 20051118