EP 1876261 B1 20120822 - Electroless copper and redox couples
Title (en)
Electroless copper and redox couples
Title (de)
Stromlose Kupfer- und Redoxpaare
Title (fr)
Dépôt autocatalytique de cuivre et couples redox
Publication
Application
Priority
US 81925006 P 20060707
Abstract (en)
[origin: EP1876261A1] Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
IPC 8 full level
C23C 18/40 (2006.01)
CPC (source: EP KR US)
C23C 18/38 (2013.01 - KR); C23C 18/40 (2013.01 - EP US)
Designated contracting state (EPC)
DE GB
DOCDB simple family (publication)
EP 1876261 A1 20080109; EP 1876261 B1 20120822; CN 101104927 A 20080116; CN 101104927 B 20101229; JP 2008101268 A 20080501; JP 2013163867 A 20130822; JP 5507800 B2 20140528; JP 5671095 B2 20150218; KR 101410676 B1 20140624; KR 20080005126 A 20080110; TW 200813253 A 20080316; TW I348499 B 20110911; US 2008038449 A1 20080214; US 7527681 B2 20090505
DOCDB simple family (application)
EP 07252709 A 20070705; CN 200710127864 A 20070706; JP 2007178544 A 20070706; JP 2013103977 A 20130516; KR 20070067973 A 20070706; TW 96123948 A 20070702; US 82535507 A 20070706