Global Patent Index - EP 1877867 A2

EP 1877867 A2 20080116 - METHODS AND APPARATUS FOR THE MANUFACTURE OF MICROSTRUCTURES

Title (en)

METHODS AND APPARATUS FOR THE MANUFACTURE OF MICROSTRUCTURES

Title (de)

VERFAHREN UND GERÄT ZUR HERSTELLUNG VON MIKROSTRUKTUREN

Title (fr)

PROCEDES ET APPAREIL DE FABRICATION DE MICROSTRUCTURES

Publication

EP 1877867 A2 20080116 (EN)

Application

EP 06726858 A 20060421

Priority

  • GB 2006001468 W 20060421
  • GB 0508101 A 20050421
  • GB 0511976 A 20050613

Abstract (en)

[origin: WO2006111766A2] A method of manufacturing microstructures is disclosed, the method comprising a applying a mask to substrate; forming a pattern in the mask; processing the substrate according to the pattern; and mechanically removing the mask from the substrate. A polymer mask is disclosed for manufacturing micro scale structure, the polymer mask comprising a thin, preferably ultra thin flexible film. A method of manufacturing an integrated circuit is disclosed, the method comprising forming a plurality of isolated semiconductor devices on a common substrate; and connecting some of the devices. Apparatus for manufacturing microstructures is disclosed comprising: a mechanism for coating a mass substrate to create a structure; a mechanism for removing a mask from the substrate; and processing apparatus. A thin film transistor is disclosed comprising drain source and gate electrodes, the drain and source electrode being separated by a semiconductor, and the gate electrode being separated from the semiconductor by an insulator, comprising a bandgap alignment layer disposed between a semiconductor and the insulator.

IPC 8 full level

C23C 14/04 (2006.01); G03F 7/12 (2006.01)

CPC (source: EP)

B81C 1/00428 (2013.01); G03F 7/12 (2013.01); H01L 27/1292 (2013.01); H01L 29/41733 (2013.01); H01L 29/42384 (2013.01); H01L 29/4908 (2013.01); H01L 29/66757 (2013.01); H01L 29/66765 (2013.01); H01L 29/78603 (2013.01); H01L 29/7869 (2013.01); H10K 71/231 (2023.02)

Citation (search report)

See references of WO 2006111766A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2006111766 A2 20061026; WO 2006111766 A3 20070118; EP 1877867 A2 20080116

DOCDB simple family (application)

GB 2006001468 W 20060421; EP 06726858 A 20060421