EP 1880032 A4 20090304 - TIN ALLOY SOLDER COMPOSITIONS
Title (en)
TIN ALLOY SOLDER COMPOSITIONS
Title (de)
LÖTZUSAMMENSETZUNGEN AUS ZINNLEGIERUNG
Title (fr)
COMPOSITIONS DE BRASURE A BASE D'ALLIAGE D'ETAIN
Publication
Application
Priority
- US 2006018235 W 20060511
- US 67986905 P 20050511
Abstract (en)
[origin: WO2006122240A2] A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises about 0.01% to about 4.5% silver; about 0.01% to about 3% copper; about 0.002% to about 5.0% antimony; about 85% to about 99% tin and about 0.002% to about 1% of either nickel or cobalt. The alloy composition has a melting temperature of about 217° C, with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.
IPC 8 full level
B23K 35/26 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01)
CPC (source: EP US)
B23K 35/0244 (2013.01 - EP US); B23K 35/262 (2013.01 - EP US); C22C 13/00 (2013.01 - EP US); C22C 13/02 (2013.01 - EP US); B23K 2101/36 (2018.07 - EP US)
Citation (search report)
- [X] US 5837191 A 19981117 - GICKLER ALAN E [US]
- [XD] US 4758407 A 19880719 - BALLENTINE RICHARD E [US], et al
- [XY] DE 19816671 A1 19981022 - FUJI ELECTRIC CO LTD [JP]
- [X] JP 2004141910 A 20040520 - SENJU METAL INDUSTRY CO, et al
- [YD] WO 9425634 A1 19941110 - SEELIG KARL F [US], et al
- [A] WO 0134860 A1 20010517 - EUROMAT GMBH [DE], et al
- [Y] KARIM Z S ET AL: "LEAD-FREE SOLDER BUMP TECHNOLOGIES FOR FLIP-CHIP PACKAGING APPLICATIONS", PROCEEDINGS OF THE SPIE, SPIE, vol. 4587, 9 November 2001 (2001-11-09), pages 581 - 587, XP008029398
- See references of WO 2006122240A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006122240 A2 20061116; WO 2006122240 A3 20070201; CA 2607286 A1 20061116; EP 1880032 A2 20080123; EP 1880032 A4 20090304; MX 2007013971 A 20080222; US 2006263234 A1 20061123
DOCDB simple family (application)
US 2006018235 W 20060511; CA 2607286 A 20060511; EP 06759560 A 20060511; MX 2007013971 A 20060511; US 43229906 A 20060511