Global Patent Index - EP 1880502 A1

EP 1880502 A1 20080123 - XDSL-TRANSMISSION PATH

Title (en)

XDSL-TRANSMISSION PATH

Title (de)

XDSL-ÜBERTRAGUNGSSTRECKE

Title (fr)

VOIE DE TRANSMISSION XDSL

Publication

EP 1880502 A1 20080123 (DE)

Application

EP 06776033 A 20060515

Priority

  • EP 2006004552 W 20060515
  • EP 05010455 A 20050513
  • EP 06776033 A 20060515

Abstract (en)

[origin: EP1722488A1] SHDSL transmission path comprises modem (1,2), whereby each modem has a SHDSL transmission component, which is connected with the transformer for connecting the pair of copper conductor (31,32). The two modems for each transmission direction are connected with each other over a separate pair of copper conductors.

IPC 8 full level

H04L 5/16 (2006.01); H04L 5/02 (2006.01); H04L 27/26 (2006.01); H04M 11/06 (2006.01)

CPC (source: EP)

H04B 3/32 (2013.01); H04L 5/16 (2013.01); H04M 11/062 (2013.01)

Citation (search report)

See references of WO 2006133781A1

Citation (examination)

  • US 6760434 B1 20040706 - REZVANI BEHROOZ [US], et al
  • "Transmission and Multiplexing (TM); Access transmission system on metallic access cables; Symmetric single pair high bitrate Digital Subscriber Line (SDSL); Draft ETSI TS 101 524", ETSI STANDARDS, LIS, SOPHIA ANTIPOLIS CEDEX, FRANCE, vol. TM-6, no. V1.2.1, 1 June 2004 (2004-06-01), XP014035178, ISSN: 0000-0001
  • YOUNG G ET AL: "Design issues for early high bit-rate digital subscriber lines", COMMUNICATIONS : CONNECTING THE FUTURE. SAN DIEGO, DEC. 2- 5, 1990; [PROCEEDINGS OF THE GLOBAL TELECOMMUNICATIONS CONFERENCE AND EXHIBITION (GLOBECOM)], NEW YORK, IEEE, US, vol. -, 2 December 1990 (1990-12-02), pages 1177 - 1182, XP010038845, ISBN: 978-0-87942-632-3, DOI: DOI:10.1109/GLOCOM.1990.116685
  • IM G-H ET AL: "Bandwidth-efficient digital transmission up to 155 Mb/s over unshielded twisted pair wiring", PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON COMMUNICATIONS (ICC). GENEVA, MAY 23 - 26, 1993; [PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON COMMUNICATIONS (ICC)], NEW YORK, IEEE, US, vol. 3, 23 May 1993 (1993-05-23), pages 1797 - 1803, XP010137190, ISBN: 978-0-7803-0950-0, DOI: DOI:10.1109/ICC.1993.397590

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 1722488 A1 20061115; EP 1880502 A1 20080123; WO 2006133781 A1 20061221

DOCDB simple family (application)

EP 05010455 A 20050513; EP 06776033 A 20060515; EP 2006004552 W 20060515