EP 1889334 A1 20080220 - CONTACT APPARATUS FOR MINIMIZING THE LOAD OF MECHANICALLY LOADED SMT SOLDERED JOINTS
Title (en)
CONTACT APPARATUS FOR MINIMIZING THE LOAD OF MECHANICALLY LOADED SMT SOLDERED JOINTS
Title (de)
KONTAKTVORRICHTUNG ZUR BELASTUNGSMINIMIERUNG MECHANISCH BEANSPRUCHTER SMT-LÖTSTELLEN
Title (fr)
DISPOSITIF DE CONTACT DESTINE A MINIMISER LA CHARGE DE ZONES DE BRASAGE SMT SOLLICITEES PAR DES CONTRAINTES MECANIQUES
Publication
Application
Priority
- EP 2006062837 W 20060601
- DE 202005008923 U 20050607
Abstract (en)
[origin: US2009130869A1] At least one embodiment of the invention relates to a contact apparatus for SMT placement on a printed circuit board, the contact apparatus being provided for the electrically conductive connection to at least one conductor track on the printed circuit board. The contact apparatus includes a contact holder for accommodating the contact, and the contact of the contact apparatus is provided for the connection to at least one electrical mating contact. The contact apparatus is designed on an SMT basis and can therefore be produced inexpensively and fitted easily. According to at least one embodiment of the invention, the contact apparatus has a first housing part, the housing part having at least one elongate cutout for accommodating the contact holder, and at least one stop for the contact being integrally formed on the housing part, which stop is provided for the purpose of absorbing insertion forces when contact is made between the contact and an electrical mating contact.
IPC 8 full level
H01R 13/516 (2006.01); H01R 9/05 (2006.01); H01R 12/04 (2006.01); H01R 13/04 (2006.01); H01R 13/44 (2006.01)
CPC (source: EP US)
H01R 9/0503 (2013.01 - EP US); H01R 12/716 (2013.01 - EP US); H01R 13/04 (2013.01 - EP US); H01R 13/44 (2013.01 - EP US); H01R 13/516 (2013.01 - EP US); H01R 12/515 (2013.01 - EP US)
Citation (search report)
See references of WO 2006131489A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2009130869 A1 20090521; US 7690929 B2 20100406; AT E506717 T1 20110515; BR PI0611244 A2 20100824; BR PI0611244 B1 20180529; CN 101176238 A 20080507; CN 101176238 B 20100811; DE 202005008923 U1 20050818; DE 502006009354 D1 20110601; EP 1889334 A1 20080220; EP 1889334 B1 20110420; ES 2362303 T3 20110701; WO 2006131489 A1 20061214
DOCDB simple family (application)
US 92168006 A 20060601; AT 06763459 T 20060601; BR PI0611244 A 20060601; CN 200680016654 A 20060601; DE 202005008923 U 20050607; DE 502006009354 T 20060601; EP 06763459 A 20060601; EP 2006062837 W 20060601; ES 06763459 T 20060601