Global Patent Index - EP 1891668 A1

EP 1891668 A1 20080227 - METHOD FOR MANUFACTURING A MICROMECHANICAL MOTION SENSOR, AND A MICROMECHANICAL MOTION SENSOR

Title (en)

METHOD FOR MANUFACTURING A MICROMECHANICAL MOTION SENSOR, AND A MICROMECHANICAL MOTION SENSOR

Title (de)

VERFAHREN ZUR HERSTELLUNG EINES MIKROMECHANISCHEN BEWEGUNGSSENSORS UND MIKROMECHANISCHER BEWEGUNGSSENSOR

Title (fr)

CAPTEUR DE MOUVEMENT MICROMÉCANIQUE ET SON PROCÉDÉ DE FABRICATION

Publication

EP 1891668 A1 20080227 (EN)

Application

EP 06764497 A 20060613

Priority

  • FI 2006050258 W 20060613
  • FI 20055324 A 20050617

Abstract (en)

[origin: WO2006134233A1] The present invention relates to measuring devices used in measuring physical quantities, such as acceleration, angular acceleration, or angular velocity, and, more precisely, to micromechanical motion sensors. The area, in the wafer plane, of a motion sensor component according to the present invention is smaller than the area of the motion sensor component having been dice cut and turned by 90º. Correspondingly, the height of the motion sensor component according to the present invention, the component having been turned by 90º, is smaller, in the direction of the joint, than the thickness of the wafer stack formed by the joined wafers. The object of the invention is to provide an improved method of manufacturing a micromechanical motion sensor, and to provide a micromechanical motion sensor suitable, in particular, for use in small micromechanical motion sensor solutions.

IPC 8 full level

H01L 21/461 (2006.01); B81C 99/00 (2010.01); G01C 3/08 (2006.01); G01C 19/56 (2006.01); G01P 15/08 (2006.01); G01P 15/125 (2006.01); H01L 21/78 (2006.01)

IPC 8 main group level

G01P (2006.01)

CPC (source: EP FI KR US)

G01C 3/08 (2013.01 - EP US); G01C 19/56 (2013.01 - KR); G01C 19/5656 (2013.01 - EP US); G01P 15/0802 (2013.01 - EP US); G01P 15/125 (2013.01 - EP FI US); H01L 21/461 (2013.01 - FI); Y10T 29/49007 (2015.01 - EP US)

Citation (search report)

See references of WO 2006134233A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2006134233 A1 20061221; WO 2006134233 A9 20071025; CA 2612283 A1 20061221; CN 101199047 A 20080611; EP 1891668 A1 20080227; FI 119307 B 20080930; FI 20055324 A0 20050617; FI 20055324 A 20070301; IL 187939 A0 20080320; JP 2008544513 A 20081204; KR 20080031282 A 20080408; NO 20080337 L 20080314; US 2007012108 A1 20070118; US 7682861 B2 20100323

DOCDB simple family (application)

FI 2006050258 W 20060613; CA 2612283 A 20060613; CN 200680021779 A 20060613; EP 06764497 A 20060613; FI 20055324 A 20050617; IL 18793907 A 20071206; JP 2008516360 A 20060613; KR 20087001143 A 20080115; NO 20080337 A 20080116; US 45391406 A 20060616