EP 1894248 A2 20080305 - SEMICONDUCTOR PACKAGE WITH TRANSPARENT LID
Title (en)
SEMICONDUCTOR PACKAGE WITH TRANSPARENT LID
Title (de)
HALBLEITERKAPSELUNG MIT TRANSPARENTER KLAPPE
Title (fr)
BOITIER DE SEMI-CONDUCTEUR POSSEDANT UN COUVERCLE TRANSPARENT
Publication
Application
Priority
- IB 2006001707 W 20060622
- GB 0512732 A 20050622
Abstract (en)
[origin: WO2006136935A2] In an optical integrated circuit device a transparent element (106) is mounted over at least the optically active elements (102) in order to provide protection for the integrated circuit during use. The transparent element 106 is retained in position by adhesive (105). The adhesive (105) is deposited between and maintained in position by a pair of ridges (104) provided around the optically active element or elements. The ridges (104) are formed from an organic photolithographic gel.
IPC 8 full level
H01L 27/146 (2006.01); H01L 31/0203 (2006.01)
CPC (source: EP)
H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 31/0203 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01)
Citation (search report)
See references of WO 2006136935A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006136935 A2 20061228; WO 2006136935 A3 20070405; EP 1894248 A2 20080305; GB 0512732 D0 20050727
DOCDB simple family (application)
IB 2006001707 W 20060622; EP 06779754 A 20060622; GB 0512732 A 20050622