EP 1898668 A2 20080312 - Silicone condenser microphone
Title (en)
Silicone condenser microphone
Title (de)
Siliziumkondensatormikrofon
Title (fr)
Microphone à condensateur au silicium
Publication
Application
Priority
KR 20060087095 A 20060909
Abstract (en)
Provided is a silicon condenser microphone using a case in which a plating layer is formed on a body formed of resin. The silicon condenser microphone includes: a case having a can-shaped body with one side open, the body being formed of a resin, and a plating layer formed on the body; and a substrate on which a micro electro mechanical system (MEMS) microphone chip and an application-specific integrated circuit (ASIC) chip for processing an electrical signal are mounted, a connection pattern for attaching the case is formed, and the case is attached to the connection pattern using a conductive adhesive. The case may be formed in a cylindrical shape or a rectangular box shape. The plating layer may be formed on an inner surface, an outer surface, or an entire surface of the body and a step may be formed along an inner periphery on an end portion of an opening surface of the body. The body is formed of easily moldable resin and the plating layer is formed on the inner, outer, or entire surface of the body to prevent an external noise such as an electromagnetic wave noise from being received from the outside.
IPC 8 full level
H04R 19/04 (2006.01); H04R 31/00 (2006.01)
CPC (source: EP KR US)
H04R 1/02 (2013.01 - KR); H04R 1/06 (2013.01 - KR); H04R 19/005 (2013.01 - EP US); H04R 19/04 (2013.01 - EP KR US); H04R 31/006 (2013.01 - EP US); H04R 2201/02 (2013.01 - KR); H04R 2201/34 (2013.01 - EP US); H04R 2400/11 (2013.01 - EP US)
Citation (examination)
WO 2004114731 A2 20041229 - WAVEZERO INC [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
EP 1898668 A2 20080312; EP 1898668 A3 20091111; CN 101141834 A 20080312; JP 2008067383 A 20080321; KR 100740463 B1 20070718; MY 141179 A 20100331; SG 141311 A1 20080428; TW 200814832 A 20080316; US 2008063232 A1 20080313; WO 2008029972 A1 20080313
DOCDB simple family (application)
EP 07291071 A 20070905; CN 200710084803 A 20070227; JP 2007227978 A 20070903; KR 2006005859 W 20061229; KR 20060087095 A 20060909; MY PI20081622 A 20061229; SG 2007056492 A 20070802; TW 96107413 A 20070303; US 89904407 A 20070904