EP 1899260 A1 20080319 - METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT AND THE THUS OBTAINED MICROMECHANICAL COMPONENT
Title (en)
METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT AND THE THUS OBTAINED MICROMECHANICAL COMPONENT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES MIKROMECHANISCHEN BAUELEMENTS SOWIE MIKROMECHANISCHES BAUELEMENT
Title (fr)
PROCEDE DE FABRICATION D'UN COMPOSANT MICROMECANIQUE ET COMPOSANT MICROMECANIQUE AINSI OBTENU
Publication
Application
Priority
- EP 2006061898 W 20060427
- DE 102005029803 A 20050627
Abstract (en)
[origin: WO2007000363A1] The invention relates to a micromechanical method for producing a cavity in a substrate and, in particular a micromechanical component produced according to said method. The inventive method comprises a first step consisting in producing a first layer on a substrate or therein, in applying at least one second layer to the first layer and in producing an input hole in the said second layer in such a way that the first layer and substrate materiel is removable therethrough. Said second layer arranged above the cavity and can be subsequently used in the form of a membrane. It is also possible to apply other layers to the second layer, in such a way that they form a whole membrane, only. According to the main aspect of the invention, the first layer material is selected in such a way that a transition edge is produced in the first layer by removing the material thereof and is provided with an predeterminable angle between the substrate and the second layer.
IPC 8 full level
B81C 1/00 (2006.01)
CPC (source: EP US)
B81C 1/00595 (2013.01 - EP US); B81B 2203/0315 (2013.01 - EP US); Y10T 428/24562 (2015.01 - EP US)
Citation (search report)
See references of WO 2007000363A1
Citation (examination)
YOUNG H. LEE ET AL: "Silicon Etching Mechanisms - Doping Effect", MRS PROCEEDINGS, vol. 38, 1 January 1984 (1984-01-01), XP055255387, DOI: 10.1557/PROC-38-163
Designated contracting state (EPC)
DE IT
DOCDB simple family (publication)
DE 102005029803 A1 20070104; EP 1899260 A1 20080319; JP 2008543597 A 20081204; US 2010260974 A1 20101014; US 8481427 B2 20130709; WO 2007000363 A1 20070104
DOCDB simple family (application)
DE 102005029803 A 20050627; EP 06754905 A 20060427; EP 2006061898 W 20060427; JP 2008518770 A 20060427; US 92199906 A 20060427