EP 1900005 A1 20080319 - APPARATUS AND PROCESS FOR TREATING DIELECTRIC MATERIALS
Title (en)
APPARATUS AND PROCESS FOR TREATING DIELECTRIC MATERIALS
Title (de)
VORRICHTUNG UND PROZESS ZUM BEHANDELN VON DIELEKTRISCHEN MATERIALIEN
Title (fr)
DISPOSITIF ET PROCEDE DE TRAITMENT DES MATERIAUX DIELECTRIQUES
Publication
Application
Priority
US 2005022110 W 20050622
Abstract (en)
[origin: WO2007001281A1] Apparatuses and processes for treating dielectric materials such as low k dielectric materials, premetal dielectric materials, barrier layers, and the like, generally comprise a radiation source module, a process chamber module coupled to the radiation source module; and a loadlock chamber module in operative communication with the process chamber and a wafer handler. The atmosphere of each one of the modules can be controlled as may be desired for different types of dielectric materials. The radiation source module includes a reflector, an ultraviolet radiation source, and a plate transmissive to the wavelengths of about 150 nm to about 300 nm, to define a sealed interior region, wherein the sealed interior region is in fluid communication with a fluid source.
IPC 8 full level
H01L 21/00 (2006.01)
CPC (source: EP KR)
H01L 21/00 (2013.01 - KR); H01L 21/67115 (2013.01 - EP)
Citation (search report)
See references of WO 2007001281A1
Designated contracting state (EPC)
DE FR IT
DOCDB simple family (publication)
WO 2007001281 A1 20070104; CN 101208770 A 20080625; CN 101208770 B 20101027; EP 1900005 A1 20080319; JP 2008547217 A 20081225; JP 5051594 B2 20121017; KR 101233059 B1 20130213; KR 20080018946 A 20080228
DOCDB simple family (application)
US 2005022110 W 20050622; CN 200580050233 A 20050622; EP 05763782 A 20050622; JP 2008518099 A 20050622; KR 20087000581 A 20050622