EP 1902601 A2 20080326 - APPARATUS AND METHODS FOR CONTINUOUSLY DEPOSITING A PATTERN OF MATERIAL ONTO A SUBSTRATE
Title (en)
APPARATUS AND METHODS FOR CONTINUOUSLY DEPOSITING A PATTERN OF MATERIAL ONTO A SUBSTRATE
Title (de)
VORRICHTUNG UND VERFAHREN ZUR KONTINUIERLICHEN AUFTRAGUNG EINER MATERIALSTRUKTUR AUF EIN SUBSTRAT
Title (fr)
PROCEDE ET DISPOSITIF DE DEPOT CONTINU DE MOTIF DE MATERIAU SUR UN SUBSTRAT
Publication
Application
Priority
- US 2006027063 W 20060711
- US 17941805 A 20050712
Abstract (en)
[origin: WO2007008992A2] A pattern of material is continuously deposited onto a substrate. The substrate and a mask are continuously brought together over a portion of a drum where a deposition source emits material. The mask includes apertures that form a pattern, and the material from the deposition source passes through the pattern of the mask and collects onto the substrate to form the pattern of material. The elongation and the transverse position of the substrate and the mask may be controlled. Pattern elements of the substrate and of the mask may be sensed in order to adjust the elongation and/or the transverse position of the substrate and/or mask to maintain a precise registration. Furthermore, the apertures may have a least dimension on the order of 100 microns or less to thereby create features on the substrate having least dimensions on the order of 100 microns or less.
IPC 8 full level
B41F 15/08 (2006.01); H05K 3/12 (2006.01)
CPC (source: EP)
B41F 15/0836 (2013.01); C23C 14/042 (2013.01); C23C 14/562 (2013.01); H05K 3/143 (2013.01); B41P 2215/12 (2013.01); H05K 1/0393 (2013.01); H05K 2203/0134 (2013.01); H05K 2203/1545 (2013.01)
Citation (search report)
See references of WO 2007008992A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007008992 A2 20070118; WO 2007008992 A3 20070524; CN 100596256 C 20100324; CN 101223834 A 20080716; EP 1902601 A2 20080326; JP 2009501280 A 20090115
DOCDB simple family (application)
US 2006027063 W 20060711; CN 200680025659 A 20060711; EP 06787025 A 20060711; JP 2008521572 A 20060711