EP 1904413 A1 20080402 - PRINTABLE ETCHING MEDIA FOR SILICON DIOXIDE AND SILICON NITRIDE LAYERS
Title (en)
PRINTABLE ETCHING MEDIA FOR SILICON DIOXIDE AND SILICON NITRIDE LAYERS
Title (de)
DRUCKFÄHIGE ÄTZMEDIEN FÜR SILIZIUMDIOXID- UND SILIZIUMNITRIDSCHICHTEN
Title (fr)
AGENTS D'ATTAQUE ADAPTES A L'IMPRESSION, DESTINES A DES COUCHES DE DIOXYDE DE SILICIUM ET DE NITRURE DE SILICIUM
Publication
Application
Priority
- EP 2006005937 W 20060621
- DE 102005033724 A 20050715
Abstract (en)
[origin: WO2007009546A1] The present invention relates to a novel printable etching medium having non-Newtonian flow behaviour for etching surfaces in the production of solar cells, and also to the use thereof. The present invention furthermore also relates to etching and doping media which are suitable both for etching inorganic layers and for doping underlying layers. In particular, corresponding particle-containing compositions are involved which can be used to etch extremely fine structures very selectively without damaging or attacking adjoining areas.
IPC 8 full level
C03C 15/00 (2006.01)
CPC (source: EP KR US)
C03C 15/00 (2013.01 - EP KR US); C09K 13/04 (2013.01 - EP US); C09K 13/06 (2013.01 - EP US); H01L 31/18 (2013.01 - EP US); Y02E 10/547 (2013.01 - EP)
Citation (search report)
See references of WO 2007009546A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102005033724 A1 20070118; CN 101223116 A 20080716; CN 101223116 B 20130313; EP 1904413 A1 20080402; JP 2009501247 A 20090115; JP 2015083682 A 20150430; JP 5698897 B2 20150408; KR 101387260 B1 20140418; KR 20080033414 A 20080416; MY 150096 A 20131129; TW 200712021 A 20070401; TW I439434 B 20140601; US 2008200036 A1 20080821; US 2012032108 A1 20120209; US 8143172 B2 20120327; WO 2007009546 A1 20070125
DOCDB simple family (application)
DE 102005033724 A 20050715; CN 200680025884 A 20060621; EP 06762109 A 20060621; EP 2006005937 W 20060621; JP 2008520738 A 20060621; JP 2014231134 A 20141113; KR 20087003749 A 20060621; MY PI20063341 A 20060713; TW 95125856 A 20060714; US 201113273447 A 20111014; US 99561806 A 20060621