EP 1905067 A1 20080402 - METHOD AND DEVICE FOR SEPARATING PRODUCTS WITH A CONTROLLED CUT EDGE, AND SEPARATED PRODUCT
Title (en)
METHOD AND DEVICE FOR SEPARATING PRODUCTS WITH A CONTROLLED CUT EDGE, AND SEPARATED PRODUCT
Title (de)
VERFAHREN UND EINRICHTUNG ZUM TRENNEN VON PRODUKTEN MIT EINER GESTEUERTEN SCHNEIDKANTE UND GETRENNTES PRODUKT
Title (fr)
PROCEDE ET DISPOSITIF DE SEPARATION DE PRODUITS A L'AIDE D'UN BORD TRANCHE COMMANDE ET PRODUIT SEPARE
Publication
Application
Priority
- NL 2006050061 W 20060321
- NL 1028588 A 20050322
Abstract (en)
[origin: WO2006118454A1] The invention relates to a method for separating products, in particular semiconductor circuits, from a shared carrier by means of laser cutting. The invention also relates to a device for applying this method. The invention further also relates to a product, in particular a semiconductor mounted on a carrier, separated by means of a laser beam using such a method.
IPC 8 full level
H01L 21/304 (2006.01); B23K 26/06 (2006.01); B23K 26/40 (2006.01); H01L 21/78 (2006.01)
CPC (source: EP KR)
B23K 26/062 (2015.10 - KR); B23K 26/3576 (2018.07 - EP); B23K 26/38 (2013.01 - EP); B23K 37/08 (2013.01 - EP); H01L 21/304 (2013.01 - KR); H01L 21/78 (2013.01 - KR); B23K 2101/40 (2018.07 - EP); H01L 21/78 (2013.01 - EP)
Citation (search report)
See references of WO 2006118454A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006118454 A1 20061109; CN 101147241 A 20080319; CN 101147241 B 20110112; EP 1905067 A1 20080402; JP 2008537511 A 20080918; KR 20070121793 A 20071227; NL 1028588 C2 20060925; TW 200633809 A 20061001; TW I465310 B 20141221
DOCDB simple family (application)
NL 2006050061 W 20060321; CN 200680009225 A 20060321; EP 06716694 A 20060321; JP 2008502936 A 20060321; KR 20077024212 A 20071022; NL 1028588 A 20050322; TW 95109431 A 20060320