EP 1905072 A4 20101103 - SUBSTRATES INCLUDING A CAPPING LAYER ON ELECTRICALLY CONDUCTIVE REGIONS
Title (en)
SUBSTRATES INCLUDING A CAPPING LAYER ON ELECTRICALLY CONDUCTIVE REGIONS
Title (de)
SUBSTRATE MIT EINER KAPPENSCHICHT AUF ELEKTRISCH LEITFÄHIGEN REGIONEN
Title (fr)
SUBSTRATS COMPORTANT UNE COUCHE DE COUVERTURE SUR DES ZONES ELECTRIQUEMENT CONDUCTRICES
Publication
Application
Priority
- US 2006012098 W 20060403
- US 13281705 A 20050518
- US 13284105 A 20050518
Abstract (en)
[origin: WO2006124131A2] A masking layer is formed on a dielectric region of an electronic device so that, during subsequent formation of a capping layer on electrically conductive regions of the electronic device that are separated by the dielectric region, the masking layer inhibits formation of capping layer material on or in the dielectric region. The capping layer can be formed selectively on the electrically conductive regions or non-selectively. Capping layer material formed over the dielectric region can subsequently be removed, thus ensuring that capping layer material is formed only on the electrically conductive regions. The capping layer can be formed using appropriate processes.
IPC 8 full level
H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 29/00 (2006.01)
CPC (source: EP)
B82Y 10/00 (2013.01); B82Y 30/00 (2013.01); H01L 21/76826 (2013.01); H01L 21/76829 (2013.01); H01L 21/76834 (2013.01); H01L 21/76849 (2013.01)
Citation (search report)
- [X] US 2004213971 A1 20041028 - COLBURN MATTHEW E [US], et al
- [X] US 2004087176 A1 20040506 - COLBURN MATTHEW E [US], et al
- [A] US 2004248409 A1 20041209 - PADHI DEENESH [US], et al
- [A] US 2005001317 A1 20050106 - GANAPATHIRAMAN RAMANATH [US], et al
- [A] US 6323131 B1 20011127 - OBENG YAW SAMUEL [US], et al
- See references of WO 2006124131A2
Citation (examination)
US 2004250755 A1 20041216 - IVANOV IGOR C [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006124131 A2 20061123; WO 2006124131 A3 20090416; EP 1905072 A2 20080402; EP 1905072 A4 20101103; TW 200731459 A 20070816; TW I329349 B 20100821
DOCDB simple family (application)
US 2006012098 W 20060403; EP 06740290 A 20060403; TW 95112178 A 20060406