Global Patent Index - EP 1907176 A1

EP 1907176 A1 20080409 - DIE CUTTING UNDER VACUUM THROUGH ROLLERS

Title (en)

DIE CUTTING UNDER VACUUM THROUGH ROLLERS

Title (de)

STANZEN UNTER VAKUUM DURCH WALZEN

Title (fr)

DÉCOUPAGE À L EMPORTE-PIÈCE SOUS VIDE

Publication

EP 1907176 A1 20080409 (EN)

Application

EP 06761181 A 20060724

Priority

  • CA 2006001221 W 20060724
  • CA 2513158 A 20050725
  • US 70199505 P 20050725

Abstract (en)

[origin: WO2007012182A1] In a process and apparatus for cutting a sheet material, one or more sheets of the material are placed over a die attached to a die board. A cutting pad is placed over the sheet material. Seals are placed around or between the die board and cutting pad to create an enclosure. A vacuum is created in the enclosure or between the die board and cutting pad so as to draw the die board and cutting pad together and compress the sheets of material. The resulting assembly is passed through a roller press to cut the sheets of material. A process or apparatus for mounting dies to a die board or stripping scrap from between dies and a quick release fastener are also described.

IPC 8 full level

B26D 7/02 (2006.01); B26F 1/42 (2006.01); B26F 1/44 (2006.01)

CPC (source: EP)

B26D 7/018 (2013.01); B26F 1/42 (2013.01); B26D 2007/2607 (2013.01); B26F 1/44 (2013.01); B26F 2001/4463 (2013.01)

Citation (search report)

See references of WO 2007012182A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2007012182 A1 20070201; EP 1907176 A1 20080409

DOCDB simple family (application)

CA 2006001221 W 20060724; EP 06761181 A 20060724