EP 1909322 A1 20080409 - STACKED ELECTRONIC COMPONENT, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING STACKED ELECTRONIC COMPONENT
Title (en)
STACKED ELECTRONIC COMPONENT, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING STACKED ELECTRONIC COMPONENT
Title (de)
ELEKTRONISCHE SCHICHTKOMPONENTE, ELEKTRONISCHE VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN SCHICHTKOMPONENTE
Title (fr)
COMPOSANT ÉLECTRONIQUE SUPERPOSÉ, DISPOSITIF ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DE COMPOSANT ÉLECTRONIQUE SUPERPOSÉ
Publication
Application
Priority
- JP 2006312300 W 20060620
- JP 2005217376 A 20050727
Abstract (en)
When a multilayer electronic component having a ceramic substrate and a resin layer is mounted on a mounting substrate, the thickness of solder used in the above mounting is made not to interfere with reduction in size and height of an electronic device including the above multilayer electronic component. Recess portions (8, 9) are formed at an outside-facing major surface (7) side of a resin layer (5). In the resin layer (5), columnar conductors (10, 11) are disposed so that axis line directions thereof are aligned in a thickness direction of the resin layer (5). End portions (14, 15) of the columnar conductors (10, 11) are located inside the recess portions (8, 9) further from opening faces thereof and have end surfaces (16, 17) exposed in the recess portions (8, 9). When a multilayer electronic component (1) is mounted on a mounting substrate (26), solder is provided on the end surfaces (16, 17) of the columnar conductors (10, 11) in the recess portions (8, 9).
IPC 8 full level
H01L 23/12 (2006.01); H01L 25/00 (2006.01)
CPC (source: EP US)
H01L 21/4853 (2013.01 - EP US); H01L 21/486 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 23/49827 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H05K 1/111 (2013.01 - EP US); H05K 3/4007 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/1532 (2013.01 - EP US); H01L 2924/15787 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19106 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 1/183 (2013.01 - EP US); H05K 3/245 (2013.01 - EP US); H05K 3/28 (2013.01 - EP US); H05K 3/284 (2013.01 - EP US); H05K 3/3421 (2013.01 - EP US); H05K 3/4611 (2013.01 - EP US); H05K 3/4629 (2013.01 - EP US); H05K 2201/0367 (2013.01 - EP US); H05K 2201/09472 (2013.01 - EP US); H05K 2201/096 (2013.01 - EP US); H05K 2203/308 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US); Y10T 29/49002 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2007267218 A1 20071122; US 7463475 B2 20081209; EP 1909322 A1 20080409; EP 1909322 A4 20110803; JP 4501936 B2 20100714; JP WO2007013239 A1 20090205; WO 2007013239 A1 20070201
DOCDB simple family (application)
US 74185707 A 20070430; EP 06766961 A 20060620; JP 2006312300 W 20060620; JP 2006539167 A 20060620