EP 1910582 A2 20080416 - METHOD FOR PRODUCING A COPPER ALLOY HAVING A HIGH DAMPING CAPACITY AND ITS USE
Title (en)
METHOD FOR PRODUCING A COPPER ALLOY HAVING A HIGH DAMPING CAPACITY AND ITS USE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER KUPFERLEGIERUNG MIT HOHER DÄMPFUNGSKAPAZITÄT UND DEREN VERWENDUNG
Title (fr)
PROCEDE DE FABRICATION D'UN ALLIAGE DE CUIVRE A GRANDE CAPACITE D'AMORTISSEMENT ET SON UTILISATION
Publication
Application
Priority
- DE 2006001305 W 20060727
- DE 102005035709 A 20050727
Abstract (en)
[origin: WO2007012320A2] The invention relates to a copper alloy which is used for mechanically charged components which, during operation, are offset by vibrations and/or impacts or produce the same, and have particularly good mechanical damping. The composition of said copper alloy depends upon the use or working temperature of the component. Said copper alloy consists of 2 - 12 wt.- % manganese, 5 - 14 wt.- % aluminium and individually or in total 0 - 18 wt.- % of one or several elements, iron, cobalt, zinc, silicon, vanadium, niobium, molybdenum, chromium, tungsten, beryllium, lithium, yttrium, cerium, scandium, calcium, titanium, phosphorous, zirconium, boron, nitrogen, carbon, whereby each element does not contain more that 6 % and 100wt.- % copper. The alloy is obtained by adapting the martensite-austenitic conversion temperatures or the associated intervals M<SUB>S</SUB> - M<SUB>F</SUB> and/or A<SUB>S</SUB> A<SUB>F</SUB> to a predetermined use or working temperature of the component by variating the weight proportion of the above-mentioned alloy component during melting thereof. The damping can reach above 70 %.
IPC 8 full level
C22C 9/01 (2006.01); B22F 7/00 (2006.01); C22C 9/05 (2006.01); C22F 1/08 (2006.01)
CPC (source: EP US)
Citation (search report)
See references of WO 2007012320A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007012320 A2 20070201; WO 2007012320 A3 20070531; DE 102005035709 A1 20070215; DE 112006002577 A5 20080626; EP 1910582 A2 20080416; EP 1910582 B1 20120905; JP 2009503250 A 20090129; US 2008298999 A1 20081204
DOCDB simple family (application)
DE 2006001305 W 20060727; DE 102005035709 A 20050727; DE 112006002577 T 20060727; EP 06775757 A 20060727; JP 2008523117 A 20060727; US 99584206 A 20060727