EP 1911337 A1 20080416 - METHOD FOR TRANSFERRING ELECTRONIC COMPONENTS
Title (en)
METHOD FOR TRANSFERRING ELECTRONIC COMPONENTS
Title (de)
VERFAHREN ZUM TRANSFERIEREN VON ELEKTRONISCHEN BAUELEMENTEN
Title (fr)
PROCEDE DE TRANSFERT DES COMPOSANTS ELECTRONIQUES
Publication
Application
Priority
- EP 2006064634 W 20060725
- DE 102005036821 A 20050804
Abstract (en)
[origin: WO2007014880A1] The invention relates to a method for transferring electronic components (210), especially flip-chips or bare dies, from a sticky support film (204) onto a transfer head (250). The inventive method comprises the following steps: a) transferring the support film (204) to a vacuum pick-up device (220) which comprises a planar suction surface (223) which is provided with openings, a face of the support film (204) carrying the components (210) facing the suction surface, b) applying a reduced pressure to the vacuum pick-up device (220) so that the components (210) are sucked off by the suction surface, c) reducing the stickiness of the support film (204) so that the adhesive force exerted by the support film (204) on the components (210) is smaller than the suction force exerted by the vacuum pick-up device (220) on the components (210), d) removing the support film (204) from the vacuum pick-up device (220), the components (210) remaining on the vacuum pick-up device (220), and e) picking up the components (210) by means of a transfer head (250) which comprises at least one component holding device (252). The invention also relates a device for handling electronic components (210), especially for use as a vacuum pick-up device (220) for carrying out the inventive method.
IPC 8 full level
H05K 13/04 (2006.01); H01L 21/00 (2006.01); H05K 13/02 (2006.01)
CPC (source: EP)
H01L 21/67005 (2013.01); H01L 21/67132 (2013.01)
Citation (search report)
See references of WO 2007014880A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007014880 A1 20070208; CN 101283635 A 20081008; DE 102005036821 A1 20070315; EP 1911337 A1 20080416; JP 2009503880 A 20090129
DOCDB simple family (application)
EP 2006064634 W 20060725; CN 200680028921 A 20060725; DE 102005036821 A 20050804; EP 06777961 A 20060725; JP 2008524485 A 20060725