EP 1911591 A1 20080416 - Injection head manufacturing method and injection head
Title (en)
Injection head manufacturing method and injection head
Title (de)
Herstellungsverfahren für einen Einspritzkopf und Einspritzkopf
Title (fr)
Procédé de fabrication d'une tête d'injection et tête d'injection
Publication
Application
Priority
JP 2006280645 A 20061013
Abstract (en)
A flow path regulating member 3 for regulating an ink flow path leading into the channels 12 and 13 is formed on the rear side of the head chip 1A by exposure and development through lamination of the photo masks having an opening of a predetermined pattern, after a photosensitive resin film has been bonded on the rear side of the head chip 1A by heat and pressure without using an adhesive; this head chip 1A being characterized in that the channels 12 and 13, and drive walls 11 made up of piezoelectric elements are arranged alternately, the apertures of the channels 11 and 12 are arranged on the front side and rear side, respectively, and drive electrodes 14 are formed in channels 12 and 13.
IPC 8 full level
CPC (source: EP US)
B41J 2/055 (2013.01 - EP US); B41J 2/14209 (2013.01 - EP US); B41J 2/1609 (2013.01 - EP US); B41J 2/1623 (2013.01 - EP US); B41J 2/1631 (2013.01 - EP US); B41J 2/1642 (2013.01 - EP US); B41J 2/1646 (2013.01 - EP US); B41J 2002/14491 (2013.01 - EP US); Y10T 29/49401 (2015.01 - EP US)
Citation (search report)
- [A] US 2003011660 A1 20030116 - NISHI SHINICHI [JP], et al
- [A] US 2006055741 A1 20060316 - WATANABE HIDEO [JP], et al
- [A] EP 0505188 A2 19920923 - BROTHER IND LTD [JP]
- [A] US 2002073544 A1 20020620 - YAMADA MINORU [JP]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
EP 1911591 A1 20080416; EP 1911591 B1 20090429; AT E430033 T1 20090515; DE 602007001012 D1 20090610; JP 2008094036 A 20080424; US 2008088678 A1 20080417; US 2012154490 A1 20120621; US 8025368 B2 20110927; US 8403462 B2 20130326
DOCDB simple family (application)
EP 07254006 A 20071009; AT 07254006 T 20071009; DE 602007001012 T 20071009; JP 2006280645 A 20061013; US 201113159844 A 20110614; US 86914707 A 20071009