EP 1912225 A4 20110831 - SOFT MAGNETIC MATERIAL, PROCESS FOR PRODUCTION OF THE MATERIAL, POWDER COMPRESSED MAGNETIC CORE, AND PROCESS FOR PRODUCTION OF THE MAGNETIC CORE
Title (en)
SOFT MAGNETIC MATERIAL, PROCESS FOR PRODUCTION OF THE MATERIAL, POWDER COMPRESSED MAGNETIC CORE, AND PROCESS FOR PRODUCTION OF THE MAGNETIC CORE
Title (de)
WEICHMAGNETISCHES MATERIAL, VERFAHREN ZUR HERSTELLUNG DES MATERIALS, MAGNETISCHER KOMPRIMIERTER PULVERKERN UND VERFAHREN ZUR HERSTELLUNG DES MAGNETISCHEN KOMPRIMIERTEN PULVERKERNS
Title (fr)
MATÉRIAU MAGNÉTIQUE SOUPLE, PROCÉDÉ DE FABRICATION DU MATÉRIAU, NOYAU MAGNÉTIQUE COMPRIMÉ EN POUDRE, ET PROCÉDÉ DE FABRICATION DU NOYAU MAGNÉTIQUE
Publication
Application
Priority
- JP 2006314409 W 20060720
- JP 2005225809 A 20050803
Abstract (en)
[origin: EP1912225A1] A soft magnetic material includes a plurality of composite magnetic particles (40). Each of the plurality of composite magnetic particles (40) has a metal magnetic particle (10) including iron, a lower film (20) surrounding the surface of the metal magnetic particle (10) and including a nonferrous metal, and an insulating upper film (30) surrounding the surface of the lower film (20) and including an inorganic compound. The inorganic compound contains at least one element of oxygen and carbon. The nonferrous metal has an affinity with at least one of oxygen and carbon that is larger than such affinity of iron. The nonferrous metal has a diffusion coefficient with respect to at least one of oxygen and carbon that is smaller than such diffusion coefficient of iron. Thus, a soft magnetic material that provides desirable magnetic properties, a method of manufacturing a soft magnetic material, a dust core, and a method of manufacturing a dust core are provided.
IPC 8 full level
H01F 1/33 (2006.01); B22F 1/16 (2022.01); B22F 1/17 (2022.01); H01F 1/24 (2006.01); H01F 41/02 (2006.01)
CPC (source: EP US)
B22F 1/16 (2022.01 - EP US); B22F 1/17 (2022.01 - EP US); C22C 33/02 (2013.01 - EP US); H01F 1/24 (2013.01 - EP US); H01F 1/33 (2013.01 - EP US); H01F 3/08 (2013.01 - EP US); H01F 41/0246 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US); C22C 2202/02 (2013.01 - EP US); H01F 1/26 (2013.01 - EP US); Y10T 428/2438 (2015.01 - EP US); Y10T 428/2991 (2015.01 - EP US)
Citation (search report)
- [XI] JP 2004197115 A 20040715 - MITSUBISHI MATERIALS CORP
- [XI] JP 2005129716 A 20050519 - SUMITOMO ELECTRIC INDUSTRIES, et al
- [XI] JP 2005085967 A 20050331 - FUJI ELECTRIC HOLDINGS
- [A] US 4390361 A 19830628 - SUEYOSHI TOSHINOBU [JP], et al
- See references of WO 2007015378A1
Designated contracting state (EPC)
DE ES FR IT
DOCDB simple family (publication)
EP 1912225 A1 20080416; EP 1912225 A4 20110831; EP 1912225 B1 20160601; CN 101233586 A 20080730; CN 101233586 B 20120321; JP 2007042891 A 20070215; JP 4707054 B2 20110622; US 2008248245 A1 20081009; WO 2007015378 A1 20070208
DOCDB simple family (application)
EP 06781364 A 20060720; CN 200680028263 A 20060720; JP 2005225809 A 20050803; JP 2006314409 W 20060720; US 91970406 A 20060720