EP 1919822 A1 20080514 - METHOD OF SEALING OR WELDING TWO ELEMENTS TO ONE ANOTHER
Title (en)
METHOD OF SEALING OR WELDING TWO ELEMENTS TO ONE ANOTHER
Title (de)
VERFAHREN ZUM MITEINANDER VERSIEGELN ODER VERSCHWEISSEN VON ZWEI ELEMENTEN
Title (fr)
PROCÈDE DE SCELLEMENT OU DE SOUDURE DE DEUX ÉLÉMENTS ENTRE EUX.
Publication
Application
Priority
- FR 2006050807 W 20060821
- FR 0552612 A 20050830
Abstract (en)
[origin: FR2890067A1] The method involves producing wettability areas (10, 11) on opposing faces of protective cover and electronic components, where one area has a layer of gold and a surface area (S2) greater than a surface area (S1) of the other area. A quantity of sealing material comprising indium is deposited on one of the areas by evaporation. The wettability area (11) is brought into contact with the deposited material. Temperature of a chamber containing the elements is raised to 250 degree Celsius in a non-oxidizing atmosphere, in order to seal the cover and the components to one another by remelting.
IPC 8 full level
B81C 99/00 (2010.01)
CPC (source: EP US)
B81C 1/00269 (2013.01 - EP US); B81C 3/002 (2013.01 - EP US); H01L 24/05 (2013.01 - EP); H01L 24/10 (2013.01 - US); H01L 24/13 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); B81C 2203/019 (2013.01 - EP US); B81C 2203/032 (2013.01 - EP US); H01L 24/16 (2013.01 - EP); H01L 2224/05001 (2013.01 - EP US); H01L 2224/05644 (2013.01 - EP US); H01L 2224/13 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/13109 (2013.01 - EP US); H01L 2224/29011 (2013.01 - EP US); H01L 2224/29013 (2013.01 - EP US); H01L 2224/73103 (2013.01 - EP US); H01L 2224/73203 (2013.01 - EP US); H01L 2224/81054 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01022 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01049 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01077 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/1461 (2013.01 - EP US); H01L 2924/16235 (2013.01 - EP US); Y10T 29/49002 (2015.01 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 2007026093A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2890067 A1 20070302; FR 2890067 B1 20070921; EP 1919822 A1 20080514; JP 2009506565 A 20090212; US 2008110013 A1 20080515; US 7772041 B2 20100810; WO 2007026093 A1 20070308
DOCDB simple family (application)
FR 0552612 A 20050830; EP 06808248 A 20060821; FR 2006050807 W 20060821; JP 2008528559 A 20060821; US 1362408 A 20080114