EP 1922177 A1 20080521 - HEAT SINK FOR AN ELECTRONIC HOUSING
Title (en)
HEAT SINK FOR AN ELECTRONIC HOUSING
Title (de)
KÜHLKÖRPER FÜR ELEKTRONIKGEHÄUSE
Title (fr)
DISSIPATEUR DE CHALEUR POUR BOÎTIER ÉLECTRONIQUE
Publication
Application
Priority
- EP 2006064691 W 20060726
- DE 102005043055 A 20050909
Abstract (en)
[origin: DE102005043055B3] Production of a cooling body with cooling fins, for an electronics housing, involves (a) preparing extruded profiled slabs (13) with mutually parallel cooling fins, (b) mutually orienting the slabs to give a surface with parallel cooling fins and (c) cutting the slabs to length, using a profiled circular saw (14) with a stepped profile, to give the cooling bodies.
IPC 8 full level
B23P 13/04 (2006.01); B23P 15/26 (2006.01); H01L 21/48 (2006.01); F28F 3/04 (2006.01); H01L 23/367 (2006.01)
CPC (source: EP US)
B23P 13/04 (2013.01 - EP US); B23P 15/26 (2013.01 - EP US); F28F 1/16 (2013.01 - EP US); H01L 21/4878 (2013.01 - EP US); H01L 23/367 (2013.01 - EP US); B23P 2700/10 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); Y10T 29/4935 (2015.01 - EP US)
Citation (search report)
See references of WO 2007028672A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102005043055 B3 20061221; EP 1922177 A1 20080521; JP 2009508328 A 20090226; US 2009083980 A1 20090402; WO 2007028672 A1 20070315
DOCDB simple family (application)
DE 102005043055 A 20050909; EP 06777993 A 20060726; EP 2006064691 W 20060726; JP 2008529575 A 20060726; US 6627306 A 20060726